Bent Semiconductor Terminals for Uniform Bending Angles
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Solution Overview
Problem
Existing semiconductor devices with staggered terminal bends of varying widths and angles are prone to inconsistent bending angles and external interference, which can affect the integrity and size of the apparatus to which they are attached.
Innovation Solution
The semiconductor device features alternating inner and outer terminals with identical bend widths and staggered configurations, along with wider portions between the bends, to stabilize the bending angles and reduce external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If bends located close to the mold member and bends located away from the mold member differ in width, then the terminal configuration provides structural variation, but the bending angles become inconsistent when bent with constant bending force
Solution Approach 1:
The patent applies local quality by making the portion of the terminal between the mold member and the second bend wider than the second bend itself. This localized width variation allows the terminal to be bent at consistent angles despite the staggered bend configuration, resolving the contradiction between structural variation and manufacturing precision
Solution Approach 2:
The patent introduces asymmetry by creating a width difference between the portion of the terminal between the mold member and the second bend, and the second bend itself. This asymmetric design compensates for the staggered bend positions, ensuring uniform bending angles across all terminals while maintaining structural diversity
2Ease of manufacture
If terminals are bent with constant bending force, then the manufacturing process is simplified, but the bending angles vary when bend widths differ
Solution Approach 1:
The patent changes the geometric parameter (width) of the terminal portion between the mold member and the second bend to be wider than the second bend. This parameter modification ensures that when constant bending force is applied, all terminals achieve consistent bending angles, thereby maintaining both ease of manufacture and manufacturing precision
3Ease of operation
If staggered bends are used along one side of the mold member, then terminal arrangement is optimized, but external interference and insulation issues arise
Solution Approach 1:
The patent addresses external interference and insulation issues by introducing a width dimension variation. The portion of the terminal between the mold member and the second bend is made wider, creating additional spatial separation and insulation between adjacent terminals while maintaining the staggered bend arrangement for optimized terminal placement
Data Source
AI summary
A semiconductor device includes: a semiconductor element; a mold member covering the semiconductor element; and a first terminal and a second terminal electrically connected to the semiconductor element, protruding from one side of the mold member, and alternating along the one side. The first terminal includes a first bend, and the second terminal includes: a second bend located further from the one side of the mold member than the first bend, and having the same width as the first bend in plan view.