Bent Metallic-Plate Wiring Substrate for Better Heat Dissipation
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Solution Overview
Problem
Wiring substrates with built-in electronic components face challenges in efficiently radiating heat due to insulation-property resins with low thermal conductivity, limiting heat dissipation from electronic components.
Innovation Solution
A wiring substrate design featuring a metallic plate with a bent portion forming a bottomed box shape and a flange portion, covered by insulating and solder resist layers, which enhances heat conduction and radiation efficiency by increasing the surface area for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation-property resin is used to cover electronic components in a cavity, then the electronic component is protected and insulated, but heat radiation efficiency deteriorates due to low thermal conductivity
Solution Approach 1:
The substrate is divided into two distinct layers: an insulating layer for electrical isolation and a metallic plate layer for heat dissipation. This segmentation allows each layer to perform its specialized function without compromising the other, resolving the contradiction between insulation and heat radiation.
Solution Approach 2:
The metallic plate acts as an intermediary between the electronic component and the mounting substrate, providing a thermal conduction pathway. Heat from the component transfers through the metallic plate to the mounting substrate, bypassing the insulating layer's thermal resistance.
2Temperature
If heat is radiated through metal terminals with high thermal conductivity, then heat can be conducted efficiently, but the radiation area is limited by the small terminal surface area
Solution Approach 1:
The solution transitions from point-contact heat dissipation through terminals to a planar heat dissipation structure. The metallic plate provides a two-dimensional heat radiation surface that extends across the substrate, dramatically increasing the effective heat radiation area while maintaining efficient thermal conduction.
3Temperature
If a bent portion is formed in the metallic plate to create a space, then heat radiation area is increased, but the manufacturing process becomes more complex
Solution Approach 1:
The metallic plate is segmented into a flat portion and a bent portion that forms a space. This segmentation allows the structure to provide both heat radiation surface area and component mounting space, increasing heat radiation area without requiring entirely new manufacturing approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat radiation efficiency by allowing efficient heat transfer from electronic components to the metallic plate and subsequent radiation to the mounting substrate, effectively addressing the limitations of traditional substrates.
Implementation Method 1
heat transfer from electronic components to the metallic plate and subsequent radiation to the mounting substrate
Implementation Method 2
insulating layer that covers both surfaces of the metallic plate
Data Source
AI summary
A wiring substrate includes a metallic plate, a first through-hole, an insulating layer, a second through-hole, a wiring layer, and feedthrough wiring. The first through-hole is formed in the metallic plate. The insulating layer covers both surfaces of the metallic plate and an inner wall surface of the first through-hole. The second through-hole is formed on an inner side of the insulating layer in the first through-hole. The wiring layer is laminated on the insulating layer on both surface sides of the metallic plate. The feedthrough wiring is formed in the second through-hole, and connects the wiring layer disposed on both surface sides of the metallic plate. The metallic plate includes a bent portion that is bent in a bottomed box shape and that forms a space on one of the surface sides of the metallic plate.