Benzoxazine Mixture Low-Temperature Curing Metal Complex Catalyst

Solution Overview

Problem

Conventional thermosetting resins like phenol and melamine resins generate volatile by-products during curing, while epoxy and unsaturated polyester resins have poor flame retardancy and high costs, and polybenzoxazines require high temperatures or slow curing, which can lead to undesired weight loss and reduced thermal stability.

Innovation Solution

A benzoxazine-based mixture is created by reacting hydroxyalkylphenol with a phenol-based compound and glyoxal, then mixed with a mono amine-based compound and an aldehyde-based compound, allowing for rapid curing at low temperatures without volatile by-products, maintaining high thermal stability and low dielectric characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional curing agents (phenol, amine, phosphine) are used to lower curing temperature of polybenzoxazine, then curing temperature is reduced, but partial polymerization occurs at low temperatures and thermal stability deteriorates

Engineering Contradiction:
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent introduces a specific curing agent comprising a metal complex of formula (1) as an intermediary substance that mediates the curing reaction. This metal complex enables low-temperature curing while maintaining thermal stability by facilitating the ring-opening polymerization of oxazine rings without causing partial polymerization or degradation, thus resolving the contradiction between lowering curing temperature and maintaining thermal stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the chemical parameters of the curing agent by using a specifically designed metal complex with controlled ligand structure and metal center. This parameter change allows the curing reaction to proceed at lower temperatures while maintaining the thermal stability of the cured product, as the metal complex provides a controlled catalytic pathway that avoids the side reactions associated with conventional curing agents.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If highly reactive curing agents are used to accelerate curing reaction, then curing speed increases, but undesired weight loss occurs during polymerization

Engineering Contradiction:
Core Design Contradiction:
ProductivityVSLoss of substance

Solution Approach 1:

The metal complex curing agent acts as a controlled intermediary that accelerates the curing reaction through catalysis while maintaining reaction control. This prevents the uncontrolled side reactions and degradation that cause weight loss, as the metal complex provides a specific catalytic mechanism that promotes the desired polymerization pathway while suppressing decomposition reactions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent optimizes the chemical structure parameters of the curing agent to achieve the right balance between reactivity and stability. The metal complex structure is designed to provide sufficient catalytic activity for fast curing while maintaining thermal stability that prevents weight loss, thus resolving the contradiction between curing speed and substance retention.

Inventive Principle:
Principle #35Parameter changes

3Duration of action of moving object

If polybenzoxazine is cured at high temperatures to achieve complete curing, then curing completeness improves, but thermal stability of the cured product deteriorates

Engineering Contradiction:
Core Design Contradiction:
Duration of action of moving objectVSReliability

Solution Approach 1:

The patent fundamentally changes the temperature parameter of the curing process by using a metal complex curing agent that enables complete curing at lower temperatures. This parameter change allows achieving full conversion of oxazine rings to polymer chains without subjecting the system to high temperatures that would degrade thermal stability, thus resolving the contradiction between curing completeness and thermal stability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The benzoxazine-based mixture achieves excellent heat resistance, flame retardancy, and electrical characteristics, suitable for applications in copper clad laminates, printed circuit boards, and electronic components, while maintaining physical properties.

Implementation Method 1

In the case of thermosetting resins with benzoxazine ring in molecular structure, the oxazine ring is opened by heating and the polymerization proceeds without the formation of by-products.

Methodology Applied
Scientific EffectThermal ring-opening polymerization: Phase Change

Implementation Method 2

WO2008/034814 A2 discloses several modified acetylacetonate metal complexes as catalysts/curing agents for low temperature curing of benzoxazine-containing compositions.

Methodology Applied
Scientific EffectCatalysis: Catalysis

Data Source

PatentUS10766887B2Benzoxazine-based mixture and use thereof
Publication Date: 2020.09.08
  • US10766887B2 patent drawing
  • US10766887B2 patent drawing
  • US10766887B2 patent drawing

AI summary

The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.