BEOL Radiation Blocking Layer for IC Soft Error Reduction

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Solution Overview

Problem

Integrated circuit (IC) chips face increasing soft error rates due to ionizing radiation, which conventional external shields and special circuitry fail to effectively address, as radiation can enter through the package and consume valuable resources.

Innovation Solution

Incorporating ionizing radiation blocking materials or layers in the back end of line (BEOL) dielectric layers or as a separate layer in the IC chip, which absorb ionizing radiation, reducing soft errors without consuming additional resources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If external radiation shields are used about an IC chip, then radiation protection is improved, but radiation can still enter through the package and interconnecting solder making the shield ineffective

Engineering Contradiction:

Improveradiation protectionVSAvoidshield effectiveness

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent extracts the radiation blocking function from external shields and relocates it internally by incorporating radiation blocking materials directly into the BEOL dielectric layers of the IC chip structure, thereby eliminating the gap between external shields and radiation entry points

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces radiation blocking materials as an intermediary substance within the BEOL dielectric layers, which act as a mediator to absorb or block ionizing radiation before it reaches sensitive circuit elements, replacing the ineffective external shielding approach

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If special circuitry is used within an IC chip to prevent ionizing radiation from altering electrical states, then radiation resistance is improved, but valuable resources such as space and power are consumed

Engineering Contradiction:

Improveradiation resistanceVSAvoidcircuit resources

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent converts the harmful effect of ionizing radiation into a beneficial filtering process by using radiation blocking materials that selectively absorb harmful radiation while allowing normal circuit operation, thereby protecting circuits without requiring additional complex radiation-resistant circuitry

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent replaces the mechanical/electrical approach of using special radiation-resistant circuitry with a materials science approach by incorporating radiation blocking materials into the BEOL dielectric layers, thereby eliminating the need for resource-consuming special circuitry

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If IC chip circuitry is continually miniaturized to improve performance, then chip performance is improved, but soft error rates caused by ionizing radiation increase

Engineering Contradiction:

Improvechip performanceVSAvoidsoft error rate

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent addresses the miniaturization problem by adding a new dimensional layer of protection within the existing chip structure - incorporating radiation blocking materials into the BEOL dielectric layers - thereby providing radiation protection without increasing the lateral footprint or compromising the miniaturized circuit design

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ionizing radiation blocking materials or layers effectively absorb radiation, reducing soft errors and enhancing IC chip performance by minimizing the impact of radiation-induced electrical state changes.

Implementation Method 1

The ionizing radiation blocking material or layer absorbs ionizing radiation and reduces soft errors within the IC chip

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Data Source

PatentUS10784200B2Ionizing radiation blocking in IC chip to reduce soft errors

Publication Date: 2020.09.22 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

Methods of blocking ionizing radiation to reduce soft errors and resulting IC chips are disclosed. One embodiment includes forming a front end of line (FEOL) for an integrated circuit (IC) chip; and forming at least one back end of line (BEOL) dielectric layer including ionizing radiation blocking material therein. Another embodiment includes forming a front end of line (FEOL) for an integrated circuit (IC) chip; and forming an ionizing radiation blocking layer positioned in a back end of line (BEOL) of the IC chip. The ionizing radiation blocking material or layer absorbs ionizing radiation and reduces soft errors within the IC chip.