Bernoulli Atomic Layer Deposition Substrate Stabilization
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Solution Overview
Problem
Existing substrate processing methods using fluidic levitation face challenges in maintaining positional stability and preventing lateral motion of substrates during processing, particularly with the use of reactive chemical fluids, which can lead to equipment failure and substrate defects due to uncontrollable reactivity and deposition issues.
Innovation Solution
The implementation of a method and apparatus that employs a levitation stabilizing structure on the substrate to control lateral motion using orthogonal and non-orthogonal jets, combined with a coaxial compound fluid flow to manage chemical reactivity and prevent unwanted reactions, ensuring stable fluidic levitation and uniform gas dispersion for atomic layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If fluidic levitation is used to process substrates, then contactless processing and substrate protection are improved, but positional stability and control of substrate lateral motion deteriorate
Solution Approach 1:
A stabilizing structure is introduced as an intermediary element on the substrate surface that interacts with the fluid flow to provide lateral motion control. This structure acts as a mediator between the fluidic levitation system and the substrate, enabling positional stability without direct contact.
Solution Approach 2:
The stabilizing structure creates localized regions on the substrate surface with different fluid interaction properties. By designing specific geometric features at particular locations, the system achieves differential fluid forces that control lateral motion while maintaining overall contactless processing.
2Productivity
If reactive chemical fluids are used for deposition, then film formation capability is improved, but unwanted reactions and equipment failure increase
Solution Approach 1:
The stabilizing structure serves as an intermediary that controls the interaction between reactive chemical fluids and the substrate. It manages the deposition process by regulating fluid-substrate contact zones, preventing unwanted reactions in sensitive equipment areas while maintaining efficient film formation on the substrate.
Solution Approach 2:
The system controls the physical and chemical parameters of fluid-substrate interaction through the stabilizing structure. By adjusting fluid flow parameters and stabilizing structure geometry, the system optimizes deposition efficiency while preventing harmful reactions that could compromise equipment integrity.
3Manufacturing precision
If orthogonal and non-orthogonal jets are used to control lateral motion, then positional control is improved, but device complexity increases
Solution Approach 1:
The stabilizing structure incorporates asymmetric geometric features that interact differently with orthogonal and non-orthogonal fluid jets. This asymmetry enables precise lateral motion control by creating differential fluid forces, achieving positional control without requiring complex active feedback systems.
Solution Approach 2:
The stabilizing structure is divided into multiple functional regions that independently interact with different fluid jet components. This segmentation allows each region to control specific aspects of lateral motion, simplifying the overall control system while maintaining precise positional control capability.
4Reliability
If coaxial compound fluid flow is used to manage chemical reactivity, then unwanted reactions are prevented, but fluid system complexity increases
Solution Approach 1:
The coaxial compound fluid flow system employs a nested structure where one fluid flow is contained within another. This nested arrangement allows management of chemical reactivity by controlling the interaction between different fluid components, preventing unwanted reactions while maintaining a relatively simple overall fluid delivery architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves stable positional control of substrates during processing, reduces substrate defects, and prevents unwanted reactions, enabling efficient and uniform deposition of atomic layers while maintaining equipment integrity.
Implementation Method 1
employing Bernoulli effects
Implementation Method 2
depositing atomic layers on a substrate by employing Bernoulli effects
Data Source
AI summary
A method for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition provides a chamber including a stationary support, through which fluid flows, that supports a moveable substrate. A moveable substrate includes a levitation stabilizing structure on the substrate that defines an enclosed interior impingement area of the substrate. The moveable substrate is positioned proximate to the stationary support so that the stationary support extends beyond the enclosed interior impingement area and the fluid flow is directed within the enclosed interior impingement area of the moveable substrate. A fluid flow, provided from a pressurized-gas source through the stationary support, impinges on the moveable substrate surface within the enclosed interior impingement area to levitate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure to deposit a thin film on the moveable substrate.