Bernoulli Transfer Pad Segmentation for Wafer Suction Adjustment
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Solution Overview
Problem
Existing transfer apparatuses for semiconductor wafers require significant cost and time to adjust suction force due to varying wafer weights, as they rely on replacing Bernoulli transfer pads to accommodate different weights and thicknesses.
Innovation Solution
A transfer apparatus with a Bernoulli transfer pad featuring a cylindrical pad body and an annular pad mounting portion, allowing for the selection and mounting of annular pads with different diameters to adjust suction force without replacing the pad body, thereby accommodating wafers of varying weights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the Bernoulli transfer pad is replaced to change suction force for wafers of different weights, then the suction force can be suitably adjusted, but the cost and time for changing the suction force increase significantly
Solution Approach 1:
The Bernoulli transfer pad is divided into two separable parts: a reusable pad body and replaceable annular pads. Only the annular pad needs to be changed to adjust suction force, not the entire transfer pad assembly. This segmentation reduces the time and complexity of adjustment while maintaining adaptability to different wafer weights.
Solution Approach 2:
The pad body is designed as a universal component that can work with multiple types of annular pads having different outer diameters. This allows a single pad body to serve multiple functions by simply changing the annular pad, thereby reducing the need for multiple complete transfer pad assemblies and lowering adjustment time.
2Adaptability or versatility
If the Bernoulli transfer pad is replaced to change suction force for wafers of different weights, then the suction force can be suitably adjusted, but the cost for changing the suction force increases significantly
Solution Approach 1:
By segmenting the transfer pad into a durable pad body and cheaper annular pads, the cost of adjustment is significantly reduced. Only the inexpensive annular pad needs to be replaced, not the expensive pad body, making the system more cost-effective for handling wafers of different weights.
Solution Approach 2:
The annular pads are designed as inexpensive, replaceable components that can be easily discarded and replaced. This approach uses cheap components for the parts that need frequent changing, while preserving the expensive pad body, thereby reducing the overall cost of adapting to different wafer weights.
3Adaptability or versatility
If annular pads with different outer diameters are mounted on the pad body, then the suction force can be adjusted for different wafer weights, but the device complexity increases
Solution Approach 1:
The segmentation into pad body and annular pads actually simplifies the overall system by allowing standardized, pre-manufactured components to be used. The pad body contains built-in mounting portions that automatically guide and secure the correct annular pad, reducing the need for complex adjustment mechanisms.
Solution Approach 2:
The pad body incorporates universal mounting portions that can accommodate multiple types of annular pads. This universal design simplifies the system by using a single pad body structure that works with various annular pads, rather than requiring different pad body designs for different applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the cost and time required to change the suction force of the Bernoulli transfer pad, enabling efficient handling of wafers with different weights without the need for frequent pad replacements.
Implementation Method 1
a Bernoulli transfer pad capable of sucking the wafer in a noncontact condition
Data Source
AI summary
A transfer apparatus holdes a plate-shaped workpiece under suction in a noncontact condition and transfers the workpiece. The transfer apparatus includes a base, a Bernoulli transfer pad fixed to the base for spraying air toward the workpiece to produce a vacuum, and a moving unit for moving the base. The Bernoulli transfer pad includes a cylindrical pad body. The pad body has a lower surface as a holding surface to which a fluid spraying portion opens and an annular pad mounting portion for mounting an annular pad. When the annular pad is mounted on the annular pad mounting portion, the holding surface is increased in a radial direction of the pad body to thereby increase a suction force for sucking the workpiece.