Bernoulli Plate Substrate Handling With Edge Centering
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Solution Overview
Problem
The increasing size of substrates in microelectronics manufacturing poses challenges in handling due to increased weight, brittleness, and the risk of damage, especially during vertical surface treatments, as existing mechanical grippers often contact sensitive areas, leading to potential damage and economic losses.
Innovation Solution
A substrate handling device utilizing a Bernoulli plate with distributed Bernoulli cups and a mechanical centering mechanism with edge grippers, which applies a local under-pressure force to hold the substrate contactlessly, allowing for secure handling and positioning without mechanical contact on sensitive areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical grippers are used to grip substrates at the sides, then substrates can be held and transported, but the grippers may contact sensitive areas and cause damage
Solution Approach 1:
The patent replaces traditional mechanical grippers with a magnetic field-based holding system. Magnets embedded in the handling device create magnetic attraction forces that hold the substrate without mechanical contact, eliminating the risk of mechanical damage to sensitive structures while maintaining secure transport
Solution Approach 2:
The patent introduces a magnetic field as an intermediary between the handling device and the substrate. This magnetic field acts as a non-contact mediator that exerts holding force on the substrate, avoiding direct mechanical contact with sensitive areas while still enabling secure handling and transport
2Productivity
If substrates are positioned vertically for surface treatment, then treatment efficiency improves, but handling difficulty increases due to weight and brittleness
Solution Approach 1:
The patent uses magnetic attraction force to counteract the gravitational force on vertically positioned substrates. The magnetic holding force supports the substrate weight, preventing sagging and deformation, thereby enabling stable vertical positioning for efficient surface treatment without handling difficulties
3Productivity
If substrate size increases to accommodate large size technology requirements, then manufacturing efficiency increases, but handling risk and costs increase dramatically
Solution Approach 1:
The patent replaces mechanical contact-based handling with magnetic field-based holding, which is particularly advantageous for large, thin, and fragile substrates. The magnetic field distributes holding force uniformly across the substrate surface, preventing localized stress concentrations that could cause damage to large-scale substrates
Solution Approach 2:
The patent employs adjustable magnetic field strength that can be dynamically controlled based on substrate size, weight, and fragility. This dynamic adjustment allows optimal holding force for different substrate scales, maintaining handling safety while accommodating increasing substrate dimensions for high-efficiency manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures safe transportation and handling of large substrates by providing a secure, contactless holding force that reduces the risk of damage to sensitive structures, enabling precise positioning and flattening, thus improving handling efficiency and reducing economic losses.
Implementation Method 1
The Bernoulli cups are distributed on a front side (opposite to the back side) of the Bernoulli plate and the Bernoulli cups are configured to provide a local under pressure to hold the substrate in a plane parallel to the Bernoulli plate
Data Source
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AI summary
The disclosure relates to a substrate handling device 11 for handling a substrate 1, a substrate handling system 10, a use of the substrate handling device 11 or the substrate handling system 10 and a substrate handling method. The substrate handling device 11 for handling a substrate 1 comprises a Bernoulli plate 13, several Bernoulli cups 13a, and a mechanical centering mechanism 14 comprising edge grippers 14a and at least a drive unit 14b. The edge grippers 14a are arranged along edges of the Bernoulli plate 13 to contact edges of the substrate 1 to grip the substrate 1. The drive unit 14b is arranged at a back side of the Bernoulli plate 13 and the drive unit 14b is configured to drive the edge grippers 14a relative to the Bernoulli plate 13 to position the substrate 1 relative to the Bernoulli plate 13. The Bernoulli cups 13a are distributed on a front side of the Bernoulli plate 13 and the Bernoulli cups 13a are configured to provide a local under pressure to hold the substrate 1 in a plane parallel to the Bernoulli plate 13.