Beryllium Copper Probe Barrel with Ni Reinforcement
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Solution Overview
Problem
The miniaturization of electronic components has led to demands for narrower pitch and smaller outer diameters of contact probes, which compromises the strength and conductivity of cylindrical members used in contact probes and semiconductor inspection sockets, as existing methods like electroforming and copper-based material processing face challenges in forming thin barrels with adequate strength and uniform plating.
Innovation Solution
A cylindrical member with a beryllium copper base material and Ni-based and Au-based coating layers, where the Ni-based layer provides reinforcement and the Au-based layer enhances conductivity, applied through plating treatments to ensure both strength and conductivity, with specific thickness ratios and notches for uniform plating and corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the outer diameter of the barrel is reduced to accommodate miniaturization demands, then the pitch of contact probes can be narrowed, but the strength and conductivity of the barrel deteriorate
Solution Approach 1:
The patent applies composite material structure by combining a copper-based alloy base material with nickel-based coating layers. The copper-based base provides ductility and formability for thin-walled structures, while the nickel-based coatings provide enhanced strength and conductivity. This composite approach allows the barrel to achieve both reduced outer diameter and maintained mechanical properties.
Solution Approach 2:
The patent utilizes parameter changes by controlling the thickness ratio between the base material and coating layers, and by adjusting the alloy composition parameters. Specifically, the base material has a thickness of 13-25 μm with nickel-based coatings applied at controlled thicknesses, creating an optimized structure that balances strength, conductivity, and miniaturization requirements.
2Length of moving object
If the outer diameter of the barrel is reduced to accommodate miniaturization demands, then the pitch of contact probes can be narrowed, but the conductivity of the barrel deteriorates
Solution Approach 1:
The patent applies composite material structure by combining a copper-based alloy base material with nickel-based coating layers. The copper-based base provides ductility and formability for thin-walled structures, while the nickel-based coatings provide enhanced strength and conductivity. This composite approach allows the barrel to achieve both reduced outer diameter and maintained mechanical properties.
Solution Approach 2:
The patent utilizes parameter changes by controlling the thickness ratio between the base material and coating layers, and by adjusting the alloy composition parameters. Specifically, the base material has a thickness of 13-25 μm with nickel-based coatings applied at controlled thicknesses, creating an optimized structure that balances strength, conductivity, and miniaturization requirements.
3Strength
If electroforming is used to grow Ni layer to suppress strength reduction, then the strength can be maintained, but the conductivity deteriorates
Solution Approach 1:
The patent applies composite material structure by combining a copper-based alloy base material with nickel-based coating layers. The copper-based base provides ductility and formability for thin-walled structures, while the nickel-based coatings provide enhanced strength and conductivity. This composite approach allows the barrel to achieve both reduced outer diameter and maintained mechanical properties.
Solution Approach 2:
The patent utilizes parameter changes by controlling the thickness ratio between the base material and coating layers, and by adjusting the alloy composition parameters. Specifically, the base material has a thickness of 13-25 μm with nickel-based coatings applied at controlled thicknesses, creating an optimized structure that balances strength, conductivity, and miniaturization requirements.
4Reliability
If copper-based material is used for good conductivity, then the conductivity is ensured, but the strength decreases due to thinning
Solution Approach 1:
The patent applies composite material structure by combining a copper-based alloy base material with nickel-based coating layers. The copper-based base provides ductility and formability for thin-walled structures, while the nickel-based coatings provide enhanced strength and conductivity. This composite approach allows the barrel to achieve both reduced outer diameter and maintained mechanical properties.
Solution Approach 2:
The patent utilizes parameter changes by controlling the thickness ratio between the base material and coating layers, and by adjusting the alloy composition parameters. Specifically, the base material has a thickness of 13-25 μm with nickel-based coatings applied at controlled thicknesses, creating an optimized structure that balances strength, conductivity, and miniaturization requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for reduced barrel diameter while maintaining sufficient strength and conductivity, stabilizing current flow and preventing corrosion, thus addressing the challenges of miniaturization in contact probes and semiconductor inspection sockets.
Implementation Method 1
a method of growing a Ni layer by electroforming is known as an exemplary method of manufacturing a barrel
Implementation Method 2
a second coating layer that is formed on a surface of each of the first coating layers and made of a metal-based material different from the base material
Data Source
AI summary
The cylindrical member includes a cylindrical base material 40 made of beryllium copper, a first coating layer that is formed on the base material 40 and made of a Ni-based material and serves as a reinforcing material for the base material 40, and a second coating layer 42 that is formed on the first coating layers and made of a metal-based material different from the base material 40, wherein the first coating layer 41 has higher hardness than the base material 40, when the thickness of the base material 40 is represented by TB and the layer thickness of the first coating layer 41 formed on the outer surface is represented by T1OUT, the base material 40 is formed so as to satisfy 13 μm≤TB≤25 μm, and the first coating layer 41 is formed so as to satisfy T1OUT≥TB×4%.


