Beryllium Copper Ring Forging for Fine-Grain Crack Resistance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional beryllium copper alloy rings used for producing alloy ribbons experience cracks due to heat expansion and contraction during the casting process, and increasing the forging ratio to micronize crystal grains has limitations and increases production costs.

Innovation Solution

A method involving ring forging with a high reduction ratio on a ring intermediate product to produce a beryllium copper alloy ring with crystal grains of 20 μm or less, including steps of hole opening, hole expansion, solution annealing, and precipitation hardening.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the forging ratio is increased to micronize crystal grains, then the average crystal grain size is reduced, but the production cost increases

Engineering Contradiction:
Improveaverage crystal grain sizeVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention changes the parameter of reduction ratio in ring forging from conventional values to 63% or more, achieving micronized crystal grains (20 μm or less) without excessively increasing production cost. This parameter change resolves the contradiction by finding an optimal threshold value that delivers the desired grain refinement while maintaining cost-effectiveness.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the forging ratio is increased to micronize crystal grains, then cracks are reduced, but production cost increases

Engineering Contradiction:
Improvecrack resistanceVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By setting the reduction ratio at 63% or more during ring forging, the invention achieves sufficient crack resistance through crystal grain micronization without incurring excessive production costs. This optimized parameter range balances reliability improvement with manufacturing economy.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If ring forging with high reduction ratio is performed, then crystal grains are micronized to 20 μm or less, but the process complexity increases

Engineering Contradiction:
Improveaverage crystal grain sizeVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention performs preliminary ring forging with high reduction ratio (63% or more) on the ring intermediate product before final ring formation. This preliminary action micronizes the crystal grains early in the process, simplifying subsequent steps and achieving the desired grain size without overly complicating the overall manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces cracks in the beryllium copper alloy ring by micronizing crystal grains, achieving smaller average grain sizes while lowering production costs compared to conventional methods.

Implementation Method 1

performing a solution annealing and a precipitation hardening on the ring-forged product

Methodology Applied
Scientific EffectSolution annealing: Heat Treatment

Implementation Method 2

performing a solution annealing and a precipitation hardening on the ring-forged product to make the beryllium copper alloy ring

Methodology Applied
Scientific EffectPrecipitation hardening: Precipitation Hardening

Data Source

PatentUS11746404B2Beryllium copper alloy ring and method for producing same
Publication Date: 2023.09.05 NGK INSULATORS LTD
  • US11746404B2 patent drawing
  • US11746404B2 patent drawing
  • US11746404B2 patent drawing

AI summary

Provided is a method for producing a beryllium copper alloy ring including: providing a columnar forged material made of a beryllium copper alloy, opening a hole from a center of an upper surface of the columnar forged material in a direction parallel to a central axis of the columnar forged material to make a ring intermediate product, performing ring forging on the ring intermediate product, thereby expanding the hole such that a reduction ratio of 63% or more is achieved to make a ring-forged product, wherein the reduction ratio is specified by the following expression: P=100×(T−t)/T, wherein P represents the reduction ratio (%), T represents a thickness (mm) of the ring intermediate product, and t represents a thickness (mm) of the ring-forged product, and performing a solution annealing and a precipitation hardening on the ring-forged product to make the beryllium copper alloy ring.