Bessel Beam Matrix for Thick Sample Laser Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional Gaussian beams have a short Rayleigh range, limiting penetration depth and requiring multiple passes for thick samples, which reduces dicing resolution and speed in laser processing applications.
Innovation Solution
A Bessel beam matrix system is developed, comprising multiple Bessel beams arranged in a matrix form, with controlled focus positions and intensity distributions, allowing for simultaneous dicing across varying depths and improved cutting precision and speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a Gaussian beam is used for laser dicing, then the beam is easy to generate and maintain, but the penetration depth into thick samples is limited and multiple passes are required
Solution Approach 1:
The patent transforms the Gaussian beam into a Bessel beam by modifying the beam's wavefront curvature and intensity distribution parameters. This parameter change enables the beam to achieve non-diffracting propagation with extended penetration depth while maintaining focus over a longer axial range, thereby resolving the contradiction between ease of generation and penetration depth.
Solution Approach 2:
The patent introduces a longitudinal dimension to the beam focus by creating a Bessel beam with an extended depth of field. Instead of a single focal point like the Gaussian beam, the Bessel beam maintains a focused intensity profile over an extended axial range, effectively adding a dimension of focus control along the propagation direction.
2Manufacturing precision
If multiple passes are used to dice thick samples with Gaussian beam, then complete cutting is achieved, but dicing resolution and speed are reduced
Solution Approach 1:
The patent merges multiple dicing operations into a single pass by utilizing the Bessel beam's extended depth of field. Multiple Bessel beams are focused at different depths simultaneously within the same axial position, allowing complete penetration and cutting of thick samples in one pass rather than requiring multiple sequential passes, thereby improving both resolution and speed.
Solution Approach 2:
The patent performs preliminary focusing of multiple Bessel beams at predetermined depths before the actual dicing process. The focus positions of individual Bessel beams are pre-configured to match the sample thickness and desired cutting depth, enabling all beams to act simultaneously on the sample in a single pass without requiring iterative adjustments.
3Productivity
If a Bessel beam matrix is used for dicing, then dicing resolution and speed are improved, but system complexity increases
Solution Approach 1:
The patent introduces a spatial light modulator (SLM) as an intermediary device that simplifies the generation and control of the Bessel beam matrix. The SLM performs the complex wavefront modulation required to create multiple Bessel beams with controlled focus positions and intensity distributions, thereby reducing the overall system complexity compared to using multiple independent laser sources or complex optical assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The Bessel beam matrix system enhances dicing resolution and speed, enabling efficient cutting of thick samples with a single pass and maintaining high precision, outperforming conventional methods by achieving better results in terms of kerf width and processing speed.
Implementation Method 1
A spatial light modulator may be used to generate the Bessel beam matrix from the Gaussian beam
Implementation Method 2
A Bessel beam is a 'non-diffracting' beam, and its transverse intensity profile does not vary as it propagates
Implementation Method 3
Each Bessel beam in the Bessel beam matrix may then be focused at a respective focus position within the sample
Data Source
AI summary
Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.