Dry Etching Method Using Beta-Diketone Filled Container
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Solution Overview
Problem
The etching rate of metal films using a β-diketone gas mixture varies significantly between the initial and later stages of a filled container's use, leading to inconsistent etching control in semiconductor manufacturing processes.
Innovation Solution
Controlling the amount of water in the etching gas to 30 mass ppm or less relative to the β-diketone, by ensuring the β-diketone filled container has a water content of 15 mass ppm or less, stabilizes the etching rate throughout the container's usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a β-diketone filled container is used to supply etching gas, then the etching process can be performed, but the etching rate varies significantly between initial and later stages of container use
Solution Approach 1:
The patent applies preliminary action by pre-drying the β-diketone liquid in the filled container before use. The container is equipped with a drying agent that removes water from the β-diketone liquid in advance, ensuring that the etching gas supplied throughout the container's usage maintains consistent water content levels, thereby stabilizing the etching rate from initial to later stages.
Solution Approach 2:
The patent applies parameter changes by controlling the water content parameter of the β-diketone liquid in the filled container. By maintaining water content at specific levels (e.g., 100 ppm or less, preferably 10 ppm or less), the etching rate consistency is improved. This parameter control ensures that the etching process remains stable throughout the container's usage period.
2Ease of operation
If water content in the etching gas is not controlled, then the filled container can be used freely, but excessive etching occurs leading to poor etching control
Solution Approach 1:
The patent introduces a drying agent as an intermediary substance in the filled container. This drying agent mediates between the β-diketone liquid and the etching gas by selectively absorbing water vapor, allowing the container to be used freely while maintaining precise control over the water content in the etching gas, thus preventing excessive etching.
Solution Approach 2:
The patent creates an inert environment within the filled container by using a drying agent that maintains a controlled atmosphere with minimal water content. This inert environment prevents unwanted water-related reactions and ensures consistent etching performance, combining ease of operation with manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent etching rates by preventing excessive etching and maintaining controlled etching performance from the initial to the later stages of the container's use, enhancing the precision of metal film processing in semiconductor manufacturing.
Implementation Method 1
the metal film contains a metal capable of forming a complex with the β-diketone
Implementation Method 2
the etching rate of the metal film is largely influenced by a slight amount of water contained in the etching gas
Data Source
AI summary
Disclosed is a dry etching method for etching a metal film on a substrate with an etching gas containing a β-diketone and an additive gas, wherein the metal film contains a metal element capable of forming a complex with the β-diketone; and wherein the amount of water contained in the etching gas is 30 mass ppm or less relative to the amount of the β-diketone. It is preferable that the β-diketone used for the dry etching method is supplied from a β-diketone filled container, wherein the β-diketone filled container has a sealed container body filled with a β-diketone whose water content is 15 mass ppm or less relative to the β-diketone. This etching method enables etching of the metal film while suppressing etching rate variations from the initial stage to the later stage of use of the filled container.