Beta-Ga2O3 Light Emitting Device Electrochemical Chip Separation
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Solution Overview
Problem
The challenge in manufacturing light emitting devices using β-Ga2O3 substrates lies in the difficulty of chip separating processes due to the non-perpendicular cleavage planes of the substrate, which affects the reliability and efficiency of the devices.
Innovation Solution
The implementation of an electrochemical etching method with a bias voltage to separate the substrate into individual light emitting device units, forming a porous layer at the lateral surface region, which enhances the chip separating process and improves manufacturing reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional chip separating processes are used on β-Ga2O3 substrates, then the substrate can be divided into individual devices, but the non-perpendicular cleavage planes cause poor separation quality and reduced device reliability
Solution Approach 1:
The patent replaces conventional mechanical chip separating processes with an electrochemical etching method. By applying a bias voltage to the β-Ga2O3 substrate in an etching solution, the substrate is divided into individual light emitting device units through electrochemical reactions rather than mechanical force. This substitution eliminates the problems caused by non-perpendicular cleavage planes and achieves clean, precise separation that improves both manufacturing precision and device reliability.
Solution Approach 2:
The patent changes the fundamental parameter of the separation process from mechanical stress to electrochemical potential. By controlling the bias voltage applied to the substrate and the composition of the etching solution, the separation process achieves precise control over the cleavage plane orientation and separation quality. This parameter change allows the substrate to be divided cleanly along desired boundaries without the defects associated with conventional mechanical methods.
2Productivity
If electrochemical etching with bias voltage is applied to separate the substrate, then chip separation efficiency and quality improve, but the process complexity increases
Solution Approach 1:
The electrochemical etching process serves multiple functions simultaneously: it separates the substrate into individual devices, forms porous layers at the separation interfaces to enhance light extraction, and creates clean separation surfaces. This multi-functionality improves chip separation efficiency while the integrated nature of the process actually simplifies the overall manufacturing workflow compared to multiple sequential mechanical steps.
Solution Approach 2:
The electrochemical etching process naturally forms porous layers at the lateral surface regions of the substrate during the separation process. These porous structures enhance light extraction efficiency from the LED devices and are created as a beneficial byproduct of the separation process itself, adding functionality without requiring additional process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient etching of the boundary between light emitting device units, improving the separation process and resulting in enhanced reliability and light extraction efficiency of the light emitting devices.
Implementation Method 1
dividing the substrate into the individual light emitting device units through electrochemical etching
Data Source
AI summary
Provided is a light emitting device. In one embodiment, a light emitting device includes: a substrate including β-Ga203; a light emitting structure on the substrate, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; an electrode on the light emitting structure; and a porous layer at a lateral surface region of the substrate.