Bevel Etching Laser Power Stabilization
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Solution Overview
Problem
Existing bevel etching methods using laser beams for semiconductor wafers face issues with inconsistent output intensity due to laser generator malfunctions or temporal changes, leading to potential over-irradiation and chipping of the wafer edges.
Innovation Solution
Incorporating a power meter to measure the laser beam output before etching, with a control unit that adjusts the output setting and performs automatic corrections to ensure the laser beam intensity remains within predetermined thresholds, preventing over-irradiation and chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laser generator is used to etch the bevel portion of a wafer, then the bevel/backside polymer can be removed, but the output intensity of the laser beam varies due to malfunction or temporal change of the laser generator
Solution Approach 1:
The patent applies preliminary action by measuring the laser beam output from the laser generator before irradiating the wafer bevel portion. The power meter performs this measurement in advance to detect any deviation from the target output value, allowing the control unit to adjust the laser generator settings beforehand and ensure consistent etching results without risking wafer damage from unstable laser output
Solution Approach 2:
The patent implements feedback control by continuously monitoring the laser beam output with a power meter and using the measured values to adjust the laser generator settings. The control unit compares the measured output against the target value and automatically corrects deviations, creating a closed-loop system that maintains reliable and consistent laser beam output throughout the etching process
2Productivity
If the laser beam output is not monitored, then the etching process can proceed without interruption, but the bevel portion of the wafer may be irradiated with laser beam having power higher than prescribed value causing scraping and chipping
Solution Approach 1:
The system performs preliminary measurement of the laser beam output before each wafer etching operation. By measuring the actual laser power in advance and verifying it against the target value, the system ensures that only properly calibrated laser beams are used for etching, preventing wafer edge damage while maintaining continuous production flow
Solution Approach 2:
The control unit continuously monitors laser beam output and provides real-time feedback to adjust the laser generator. This feedback mechanism detects deviations from the target output value and automatically corrects them before they can cause harmful effects on the wafer, thereby preventing damage while allowing the etching process to proceed without manual intervention or interruption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively monitors and stabilizes the laser beam output, preventing damage to the wafer edges and ensuring consistent etching processes, thereby improving yield and reducing product contamination.
Implementation Method 1
a laser generator configured to output the laser beam
Implementation Method 2
a power meter configured to measure an output value of the laser beam output from the laser generator
Implementation Method 3
configured to etch a substrate by emitting a laser beam
Data Source
AI summary
An etching method using a bevel etching apparatus is provided. The bevel etching apparatus is configured to etch a substrate by emitting a laser beam and includes a laser generator and a power meter configured to measure the laser beam output from the laser generator. In the method, the power meter is irradiated with the laser beam for a predetermined period of time before etching the substrate by irradiating the substrate with the laser beam. An output value of the laser beam is measured by the power meter. It is determined whether the measured output value of the laser beam is in a range of predetermined thresholds with respect to an output setting value of the laser beam output from the laser generator.