Bezel-less Touch Control Device Internal Wire Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional touch devices require a bezel for wire routing, limiting their ability to achieve full-screen touch control and causing structural and processing issues with electrical connections during the manufacturing process.
Innovation Solution
A bezel-less touch device design featuring a housing with a substrate and touch sensor, where metal pads on the substrate are connected via conductive silicone strips to corresponding pads on a circuit board, allowing for internal wire routing without a bezel, and a sensing layer made of transparent conductive films for full-screen touch control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a bezel is reserved for wire routing area, then electrical connections can be established, but full-screen touch control cannot be achieved
Solution Approach 1:
The patent moves wire routing from the two-dimensional surface plane to the three-dimensional side walls of the housing. Wires are embedded within the housing structure and side walls, allowing electrical connections without occupying screen area, thus enabling full-screen touch control while maintaining wire routing capability through spatial reconfiguration.
Solution Approach 2:
The patent nests wires and electrical connection components within the housing structure itself. The housing contains embedded wire routing channels and connection areas that are integrated into the housing body, eliminating the need for external bezel areas while maintaining electrical connectivity.
2Reliability
If wire bonding is performed before molding, then electrical connections can be established, but the circuit board may peel off
Solution Approach 1:
The patent performs wire bonding and electrical connection establishment before the molding process. By completing electrical connections in advance, the wires and circuit boards are securely positioned and bonded before the housing material is injected, preventing peeling issues that would occur if bonding attempted to happen after the rigid housing structure was already formed.
Solution Approach 2:
The manufacturing process is segmented into distinct stages: wire bonding first, then molding. This separation allows each process to be optimized independently, with wire bonding performed on accessible components before they are encased in the molded housing, ensuring both connection reliability and structural integrity.
3Shape
If molding is performed before wire bonding, then the housing shape is defined, but wiring manner is limited
Solution Approach 1:
The patent performs wire bonding before molding, allowing flexible wiring configurations to be established while components are still accessible. This preliminary action enables complex wire routing and connection arrangements that would be difficult or impossible to implement after the housing is already molded and closed.
4Manufacturing precision
If pin header is fixed after molding, then the mold can avoid the pin area, but subsequent processing and rework become more difficult
Solution Approach 1:
The patent performs wire bonding and component attachment before molding, when components are still accessible and easily manipulable. This allows pin headers and other electrical components to be securely positioned and bonded before the housing is formed, making subsequent processing and potential rework much easier compared to attempting to access and modify components after the housing is already molded and closed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables full-screen touch control without the need for a bezel, addressing structural and processing challenges related to electrical connections and enhancing the manufacturing efficiency of touch devices.
Implementation Method 1
metal pads on the substrate are connected via conductive silicone strips to corresponding pads on a circuit board
Implementation Method 2
sensing layer made of transparent conductive films for full-screen touch control
Data Source
AI summary
A touch device comprises a housing, a touch sensor and a circuit board. The housing has an inner space and an opening. The touch sensor is arranged in the inner space, and comprises a substrate, first metal pads and a sensing layer. The substrate is arranged in the inner space and corresponding to the shape of the housing. The sensing layer is arranged on the substrate and electrically connected to the first metal pads. The circuit board is arranged on the housing at a position adjacent to the opening, and comprises second metal pads facing towards the inner space and electrically connected to the first metal pads, respectively. The provided touch device can achieve full-screen touch control without the need for reserving a bezel to lay out wires.