Bezier Lens Light Emitting Module Adhesive-Free Manufacturing

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Solution Overview

Problem

The manufacturing process of light emitting modules with lenses is complex and costly due to the use of adhesives, leading to increased defect rates and longer production times, especially when multiple light emitting device packages are involved.

Innovation Solution

A light emitting module design where lenses with curved surfaces, expressed by Bezier curves, are directly contacted with light emitting device packages without adhesives, allowing for simultaneous coating and formation of lenses across multiple packages, simplifying the manufacturing process and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lenses are bonded to light emitting device packages using adhesive, then lenses are securely fixed, but manufacturing process becomes complicated and defect rate increases

Engineering Contradiction:

Improvelens fixation reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the adhesive layer from the lens bonding process. Instead of using adhesive to bond lenses to light emitting device packages, the patent uses a molding compound that directly forms the lens structure during the packaging process, removing the separate bonding step and reducing manufacturing complexity while maintaining secure fixation.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the lens formation process with the light emitting device packaging process. The molding compound that encapsulates the LED chip also forms the lens structure in one integrated step, combining what were previously separate operations (device packaging + lens attachment) into a single manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If lenses are bonded using adhesive, then lenses are securely attached, but manufacturing time increases

Engineering Contradiction:

Improvelens attachment reliabilityVSAvoidmanufacturing cycle time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lens structure is formed preliminarily during the molding compound curing process before final assembly. The molding compound is applied and cured to simultaneously package the LED chip and form the functional lens, performing the lens creation action in advance during the packaging operation rather than as a subsequent separate step.

Inventive Principle:

Principle #10Preliminary action

3Illumination intensity

If multiple light emitting device packages are used, then brightness requirement is met, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvelight output brightnessVSAvoidnumber of components

Core Design Contradiction:

Illumination intensityVSDevice complexity

Solution Approach 1:

The invention employs a curved lens surface (spheroidal or aspherical) formed by the molding compound to optimize light extraction and distribution. This curved geometry concentrates and directs light more efficiently than flat surfaces, enabling higher effective brightness from a single light emitting device package, thereby reducing the number of packages needed.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The invention changes the optical parameters of the light emitting device package by introducing a molded lens with specific curvature radius, surface shape, and material refractive index. These parameter changes enhance light extraction efficiency and luminous intensity, allowing a single package to achieve brightness levels that would otherwise require multiple packages.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs and time, minimizes defects, and enables miniaturization while maintaining brightness and improving light extraction efficiency by reducing the number of light emitting device packages required.

Implementation Method 1

a plurality of lenses located at upper surfaces of the light emitting device packages in a contact fashion, wherein each of the lenses includes a curved surface

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS10067381B2Light emitting module, backlight unit including the module, and display apparatus including the unit

Publication Date: 2018.09.04 SUZHOU LEKIN SEMICON CO LTD

AI summary

A light emitting module is disclosed. The light emitting module includes a board, a plurality of light emitting device packages mounted on the board while being spaced apart from each other, and a plurality of lenses located at upper surfaces of the light emitting device packages in a contact fashion, wherein each of the lenses includes a curved surface expressed by a start point (SP), an end point (EP), and two adjustment points (AP1 and AP2) of a Bezier curve represented as follows. SP=(x, z), EP=(x, Z_E), AP1=(X_01, Z_01), AP2=(X_02, Z_02) where x indicates positions in a direction intersecting a light axis, z indicates positions in a direction parallel to the light axis, SP is fixed, and 0.5 mm≤Z_E≤0.78 mm, 1.62 mm≤X_01≤1.8 mm, 1.44 mm≤Z_01≤1.5 mm, 0.19 mm≤X_02≤0.25 mm, and 1.06 mm≤Z_02≤1.26 mm, or X_01 is 1.0 mm, Z_01 is 0.9 mm, X_02 is 0.2 mm, Z_02 is 0.1 mm, and Z_E is 1.2 mm.