BGA Self-Alignment Structure Using Inclined Jigs and Packing Medium
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Solution Overview
Problem
The high precision requirement and complex alignment of BGA elements in printed circuit board assembly lead to issues such as rework and reduced production efficiency due to misalignment and defects in mounting.
Innovation Solution
A BGA element self-alignment structure and method involving a circuit board mechanism with a first alignment structure matching the BGA ball and a second alignment structure comprising jigs with inclined limit surfaces, applied with a titanium-plated film, to precisely align BGA elements on the printed circuit board, reducing rework and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional BGA mounting methods are used, then the assembly process is simple, but the alignment precision is insufficient leading to rework and reduced yield
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the packing medium structure before BGA mounting. These recesses are created in advance to match the BGA ball shapes and positions, ensuring that when BGA elements are placed, they automatically align with the pre-prepared recesses. This preliminary preparation of the mounting structure eliminates the need for complex real-time alignment mechanisms during assembly.
Solution Approach 2:
The patent introduces an intermediary alignment structure consisting of the packing medium with molded recesses and jigs with inclined limit surfaces. This intermediary structure mediates between the BGA balls and the printed circuit board, providing a physical interface that ensures precise alignment. The recesses in the packing medium and the inclined surfaces of the jigs act as intermediaries that guide and constrain the BGA elements into correct positions without requiring complex direct alignment between BGA and PCB.
2Manufacturing precision
If high precision alignment structures are implemented, then mounting accuracy improves, but production efficiency decreases due to complex assembly steps
Solution Approach 1:
The patent applies self-service by designing an alignment structure that performs alignment automatically without requiring external intervention or complex adjustment mechanisms. The recesses in the packing medium and the inclined limit surfaces of the jigs create a self-aligning system where the BGA elements guide themselves into the correct positions through the physical constraints provided by the recesses and inclined surfaces. This self-aligning mechanism eliminates the need for operator skill or complex alignment equipment, maintaining high productivity while achieving high precision.
3Manufacturing precision
If complex alignment procedures are used, then alignment precision increases, but rework and scraping costs increase
Solution Approach 1:
The patent prevents rework and scraping losses through preliminary action by pre-forming accurate recesses in the packing medium that match the BGA ball positions. This preliminary preparation ensures that BGA elements align correctly on the first attempt, eliminating the need for subsequent rework or scraping operations. The inclined limit surfaces of the jigs further ensure correct positioning before mounting, preventing misalignment that would lead to rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise alignment of BGA elements, reducing rework and scraping costs, and enhancing production efficiency by utilizing a combination of apertures, packing medium structures, and conducting layers on the printed circuit board, along with adjustable jigs for accurate positioning.
Implementation Method 1
a packing medium structure filled in the cavity of the aperture
Implementation Method 2
a recess matching with the shape of the BGA ball on the packing medium structure
Implementation Method 3
a conducting layer electrically conducts the lines of the printed circuit board on both sides of the recess
Implementation Method 4
the pair of jigs has oppositely set inclined limit surfaces
Data Source
AI summary
The present invention provides a BGA element self-alignment structure and an alignment method, including a printed circuit board with a first alignment structure matching with the BGA ball, and a second alignment structure on two sides of the substrate and above the printed circuit board. The BGA element is precisely aligned on the printed circuit board, which improves the mounting processing efficiency, guarantees the mounting yield of the BGA element on the printed circuit board, reduces the rework and scraping costs caused by poor BGA mounting.