BGA Camera Spacer Prevents Solder Collapse
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Solution Overview
Problem
The weight of BGA packaged camera devices, especially when coupled with a lens module, causes excessive collapse of solder balls during reflow, particularly in applications with high vibration or vertical orientation, leading to potential short circuits.
Innovation Solution
A spacer is introduced between the camera device and the PCB substrate, formed from solder mask, tape, or legend ink, to prevent excessive collapse of solder balls during reflow, with the spacer's height selected to support the device and substrate configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the camera device is coupled to a lens module to form a BGA packaged camera device, then the functionality and imaging capability are improved, but the weight of the device increases causing excessive collapse of solder balls during reflow
Solution Approach 1:
A spacer is introduced as an intermediary element between the camera device and the substrate. This spacer supports the camera device during reflow, preventing the device weight from causing excessive solder ball collapse. The spacer acts as a temporary mediator that bears the mechanical load during the critical reflow process.
Solution Approach 2:
The spacer provides beforehand cushioning by being positioned between the camera device and substrate prior to reflow. This pre-positioned support structure prevents excessive collapse of solder balls during the reflow process, cushioning against the harmful effects of device weight before the damage can occur.
2Adaptability or versatility
If the device weight is increased due to lens module coupling, then the camera device functionality is improved, but the solder ball reliability deteriorates under high vibration and vertical orientation conditions
Solution Approach 1:
The spacer serves as a mediator that decouples the direct mechanical stress between the heavy camera device and the solder balls. By introducing this intermediate support structure, the solder balls are protected from excessive mechanical loads during vibration and vertical orientation, maintaining their reliability while allowing the camera device to function properly.
Solution Approach 2:
The spacer provides a counterbalancing support structure that offsets the harmful effects of device weight on solder ball reliability. During high vibration and vertical orientation conditions, the spacer helps distribute and counteract the gravitational and vibrational forces, preventing solder ball failure while maintaining camera functionality.
3Device complexity
If no spacer is used between the device and substrate, then the assembly structure is simplified, but excessive collapse of solder balls occurs during reflow leading to short circuits
Solution Approach 1:
A minimal spacer structure is introduced as an intermediary element to maintain solder ball integrity during reflow. This simple spacer component prevents excessive collapse without significantly increasing assembly complexity, as it can be implemented using existing materials like solder mask, tape, or legend ink layers.
Solution Approach 2:
The spacer can be implemented using thin film materials such as solder mask, tape, or legend ink layers. These flexible thin films provide the necessary mechanical support to prevent solder ball collapse during reflow while adding minimal complexity to the assembly structure. The thin film nature allows easy integration into existing manufacturing processes.
Data Source
AI summary
An assembly (10) that attaches a ball grid array (BGA) packaged camera device (12) to a printed circuit board (PCB) substrate (14) is provided. The assembly (10) includes a spacer (30) between the device (12) and the substrate (14). The spacer (30) is configured to prevent excessive collapse of solder balls (26) located between the device (12) and the substrate (14) during reflow of the solder balls (26). The spacer (30) includes one of solder mask, tape, and/or legend ink.