BGA Current Sensing Wire Layout for In-Situ IC Supply Monitoring
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Solution Overview
Problem
In-situ measurement of current flow through integrated circuits (ICs) mounted on ball grid array (BGA) packages is challenging due to the invasive and disruptive nature of existing methods, which require additional hardware and disassembly, leading to reduced accuracy and increased costs.
Innovation Solution
A current sense wire is placed within a contiguous channel among solder balls to measure current flow, inducing a voltage proportional to the current, which is then amplified and converted to a digital signal using an analog-to-digital converter, allowing non-invasive monitoring without additional hardware or disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing current measurement methods are used, then current flow can be measured, but the measurement process is invasive and disruptive requiring additional hardware and disassembly
Solution Approach 1:
The current sense wire is nested within the contiguous channel formed by the solder balls array. The wire is positioned in the space between adjacent solder balls, utilizing the existing structural voids in the BGA package without requiring additional external hardware or disassembly. This nesting approach allows the measurement function to be integrated into the existing package structure.
Solution Approach 2:
The current sense wire acts as an intermediary element that indirectly measures current flow through magnetic field coupling rather than direct electrical contact. The wire surrounds a subset of solder balls and detects the magnetic field generated by current flowing through those balls, converting it to a measurable voltage signal without disrupting the electrical connections.
2Measurement precision
If existing current measurement methods are used, then current flow can be measured, but disassembly is required leading to reduced accuracy
Solution Approach 1:
The current sense wire is installed and positioned within the contiguous channel during the original assembly process, before the BGA package is finalized and deployed. The wire is placed among the solder balls while the package is still being constructed, ensuring proper positioning without requiring later disassembly or modification of the completed package.
3Measurement precision
If existing current measurement methods are used, then current flow can be measured, but additional hardware is required increasing costs
Solution Approach 1:
The contiguous channel formed by the solder balls array serves multiple functions: it provides the electrical connections for power delivery and simultaneously creates a structural pathway that accommodates the current sense wire. The solder balls both conduct current and define the measurement pathway, eliminating the need for separate measurement hardware.
Solution Approach 2:
The BGA package structure itself provides the measurement capability through its inherent contiguous channel. The arrangement of solder balls automatically creates the pathway needed for the sense wire, and the current flowing through the package generates the magnetic field needed for measurement. The system uses its own operational characteristics to enable measurement without external assistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides accurate, cost-effective, and non-invasive in-situ monitoring of IC supply currents, enhancing measurement accuracy and system reliability while avoiding system performance reductions.
Implementation Method 1
A current sense wire is placed within a contiguous channel among solder balls to measure current flow, inducing a voltage proportional to the current
Data Source
AI summary
Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.