BGA EMI Absorber Ring with Snap-Fit Projections
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Solution Overview
Problem
Electronic circuits generate electromagnetic interference (EMI) that can affect nearby circuits and violate FCC regulations, necessitating effective methods to reduce, isolate, or block electromagnetic radiation.
Innovation Solution
A geometric ring made of electromagnetic energy absorbing material is designed to fit over a ball grid array (BGA) integrated circuit package, with protrusions that snap into the gap between the package and a substrate, securing the absorber without adhesives or mechanical retention devices, and positioned to minimize EMI emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic energy absorbing material is placed proximate to the integrated circuit package, then electromagnetic interference is reduced, but device complexity increases due to the need for additional retention structures
Solution Approach 1:
The geometric ring structure is designed to be self-retaining through its own deformation characteristics. The ring deforms elastically during installation and spontaneously snaps into place, engaging with the integrated circuit package body and substrate gap without requiring external fasteners, adhesives, or additional retention mechanisms. This self-service approach eliminates complex retention structures while maintaining secure positioning of the EMI absorber.
Solution Approach 2:
The geometric ring utilizes elastic deformation as a temporary state during installation. The material's elastic properties allow the ring to be compressed or expanded during placement, then automatically return to its original shape, creating a snapping action that secures the absorber in position. This parameter change (deformation and recovery) enables simple, tool-free installation without additional retention components.
2Ease of manufacture
If a geometric ring with projections is used to secure the absorber, then retention is achieved without adhesives, but manufacturing precision is required to ensure proper fit and deformation
Solution Approach 1:
The geometric ring is constructed from elastomeric or flexible material that can deform elastically during installation. This flexibility allows the ring to accommodate variations in gap dimensions between the substrate and integrated circuit package. The material's compliance compensates for manufacturing tolerances, ensuring reliable engagement without requiring extremely precise gap dimensions or complex adjustment mechanisms.
Solution Approach 2:
The retention mechanism transitions from a static, rigid structure to a dynamic, deformable one. The geometric ring is designed to undergo controlled elastic deformation during installation, allowing it to adapt to the specific geometry of the gap. This dynamic approach enables the same ring design to accommodate a range of gap sizes and shapes, reducing the need for high manufacturing precision while maintaining secure retention.
3Reliability
If the geometric ring is deformed during installation, then it snaps into place securely, but the installation process becomes more difficult requiring deformation force
Solution Approach 1:
The geometric ring incorporates one or more notches that segment the ring structure, creating predetermined deformation zones. These notches concentrate the deformation force at specific locations, allowing the ring to be installed with reduced force compared to deforming a completely continuous structure. The notches guide the deformation process and ensure it occurs at the intended location, maintaining reliability while reducing installation difficulty.
Solution Approach 2:
The deformation required for installation is localized to specific regions of the geometric ring rather than requiring uniform deformation of the entire structure. The notches create stress concentration points where deformation initiates, allowing the installer to apply force at a single location while the rest of the ring remains relatively undisturbed. This partial action approach reduces the total force and complexity required for installation while achieving secure retention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference by placing electromagnetic energy absorbing material proximate to the integrated circuit package, minimizing radiation and adhering to regulatory limits without the need for additional fastening mechanisms.
Implementation Method 1
a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package
Data Source
AI summary
An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.