Semiconductor Input Replay Circuit for BGA Failure Localization
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Solution Overview
Problem
Existing failure analysis methods for semiconductor devices, particularly those with Ball Grid Array (BGA) packages, face challenges in specifying failure positions due to the difficulty in removing and remounting devices without dedicated tools and programs, especially when failures occur under complex conditions or without user programs.
Innovation Solution
A semiconductor device with a central processing unit (CPU), external terminal, first memory, and switching circuit that allows storing external input signals for later use, enabling failure analysis without device removal by switching input signals and using stored data for failure position specification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a BGA package semiconductor device is used, then integration density and performance are improved, but failure position specification becomes difficult due to removal and remounting challenges
Solution Approach 1:
The patent applies preliminary action by recording input signals and operational states before failure occurs. The signal recording unit captures external input signals, and the operation state recording unit records CPU operational states during normal operation, enabling later failure analysis without needing to physically remove or remount the BGA device.
Solution Approach 2:
The patent creates copies of the original operational data by storing input signals and operation states in memory units. These recorded copies can be replayed and analyzed to reproduce failure conditions, eliminating the need for physical device manipulation while maintaining analysis capability.
2Measurement precision
If device removal and remounting is performed for failure analysis, then failure position can be specified, but dedicated tools and programs are required increasing complexity
Solution Approach 1:
The semiconductor device performs self-service by incorporating built-in recording units that automatically capture input signals and operational states during normal operation. This eliminates the need for external dedicated analysis tools and programs, as the device itself generates the necessary diagnostic data.
Solution Approach 2:
The patent merges the failure analysis functionality into the semiconductor device itself by integrating signal recording units and operation state recording units within the device architecture. This combination eliminates the need for separate external analysis equipment and software.
3Adaptability or versatility
If failure analysis is performed under complex conditions without user programs, then comprehensive analysis is possible, but analysis capability is reduced without recorded data
Solution Approach 1:
The patent captures input signals and operation states in advance during normal operation, preserving critical information before failures occur. This preliminary data collection enables comprehensive failure analysis under complex conditions by having all necessary information readily available for replay and investigation.
Data Source
AI summary
A semiconductor device according to the present disclosure includes a central processing unit (CPU), an external terminal receiving a signal from outside, a memory storing an external input signal supplied via the external terminal, an input signal necessary for a processing the CPU, and a switching circuit that switches to the external input signal stored in the memory from the external input signal obtained via the external terminal.