Ball Grid Array Package with Isolated Chip Group Connections

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Solution Overview

Problem

Current multichip packages (MCPs) face issues where a defective chip can render the entire package unusable, despite other chips being operational, due to shared electrical connections, leading to wastage and reduced functionality.

Innovation Solution

The implementation of a multichip package design with dedicated electrical connections for each chip group, utilizing a ball grid array and separate sets of connections for signal and power transmission, ensuring that each chip group has isolated connections within the package, allowing for continued functionality even if one chip is defective.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If chip terminals are commonly connected together to reduce package size and increase density, then the package achieves higher density and smaller size, but a defective chip can render the entire package unusable

Engineering Contradiction:

Improvepackage sizeVSAvoidpackage functionality

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent divides the ball grid array into multiple independent groups (first ball group and second ball group), where each group is dedicated to a specific chip group. This segmentation isolates the electrical connections so that a defect in one chip does not propagate to other chips through shared connections, thereby maintaining package functionality while achieving high density through organized proximity of connections.

Inventive Principle:

Principle #1Segmentation

2Reliability

If dedicated electrical connections are provided for each chip group, then package reliability is improved and good chips are not wasted, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvepackage functionalityVSAvoidconnection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a universal ball grid array structure that serves multiple functions: it provides dedicated connections for different chip groups while maintaining a standardized external interface. The ball grid array acts as a multi-functional element that enables both isolation of chip groups and unified package connectivity, reducing the need for separate complex connection structures for each chip.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If dedicated ball groups are used for each chip group, then the package can remain operational with defective chips, but the manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage functionalityVSAvoidball group alignment

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent merges the connection structures by using a single integrated ball grid array that contains multiple dedicated ball groups. Instead of creating separate connection structures for each chip group, the ball grid array combines all dedicated connections into one unified component, simplifying the manufacturing process and reducing alignment complexity while maintaining the reliability benefits of dedicated connections.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9502345B2Ball-grid-array package, electronic system and method of manufacture

Publication Date: 2016.11.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups.