BGA Memory Sub-System Bandwidth and Capacity Optimization
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Solution Overview
Problem
High storage capacity memory devices often suffer from bandwidth limitations due to interface constraints, leading to underutilization of storage capacity and increased size and power consumption when attempting to enhance bandwidth through additional memory devices.
Innovation Solution
Incorporating ball grid array (BGA) components, which include NAND flash memory, DRAM, firmware, and a controller chip in a single package, into memory sub-systems to increase both bandwidth and storage capacity without increasing size or power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional memory devices are added to enhance bandwidth, then bandwidth is improved, but device size and power consumption increase
Solution Approach 1:
The patent combines multiple memory device functions (NAND flash, DRAM, firmware, controller) into a single BGA package, allowing bandwidth enhancement through parallel access to multiple memory blocks within the same package without increasing overall device count, thus improving productivity while controlling power consumption and device size
2Productivity
If additional memory devices are added to enhance bandwidth, then bandwidth is improved, but device size increases
Solution Approach 1:
The patent implements a nested structure where multiple memory blocks are stacked vertically within a single BGA package footprint, enabling increased bandwidth through parallel access to multiple layers while maintaining a compact device size on the PCB
3Productivity
If interface constraints are overcome to increase bandwidth, then bandwidth is improved, but device complexity increases
Solution Approach 1:
The patent segments the memory system into multiple independent memory blocks within the BGA package, each accessible through separate interfaces, allowing bandwidth enhancement through parallel operations while keeping each individual interface relatively simple and manageable
Data Source
AI summary
An apparatus includes a memory component having a plurality of ball grid array (BGA) components, wherein each respective one of the BGA components includes a plurality of memory blocks and a BGA component controller and firmware adjacent the plurality of memory blocks to manage the plurality of memory blocks. The apparatus further includes a processing device, included in the memory component, to perform memory operations on the BGA components.