Ball Grid Array Package System With Heat Spreader Access Port
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Solution Overview
Problem
The increasing demand for high-density, high-performance semiconductor devices in limited spaces poses challenges due to the complexity of multi-chip modules, where defects in one die can render the entire package unusable, leading to decreased yields and increased costs.
Innovation Solution
A ball grid array package system is developed, featuring a heat spreader with an access port, where an integrated circuit die is attached, a substrate is mounted around the die, and an electrical interconnect is coupled between the die and the substrate, allowing for the stacking of additional packages through the access port, which also serves as an EMI shield and thermal path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple die are placed within a single package to increase functionality, then device functionality is improved, but the probability of defects increases and yield decreases
Solution Approach 1:
The invention divides the multi-chip module into separate ball grid array packages, each containing a single die. This segmentation allows each package to be independently tested and validated before final assembly, ensuring that defects in one die do not compromise the entire system. The modular approach maintains high functionality while improving reliability through individual die verification.
Solution Approach 2:
The invention implements a hierarchical packaging structure where multiple ball grid array packages are stacked and interconnected through access ports in the heat spreader. Each package acts as a nested unit within the larger system, allowing independent validation of individual dies while achieving the functionality of a multi-chip module through vertical integration rather than horizontal placement.
2Adaptability or versatility
If multiple die are mounted next to each other on the mounting surface, then increased functionality is achieved, but the package area required increases
Solution Approach 1:
The invention transitions from horizontal placement of multiple die on the same mounting surface to vertical stacking of ball grid array packages. By utilizing the vertical dimension through access ports in the heat spreader, the system achieves multi-chip functionality without increasing the footprint area, effectively moving from a 2D layout to a 3D architecture.
3Productivity
If direct chip attach is used to achieve high density mounting, then mounting density is improved, but the cost of supplying known good die and fine line PCB increases
Solution Approach 1:
The invention introduces ball grid array packages as intermediary components between the die and the final application. These packages provide pre-assembled, tested, and validated units that can be manufactured independently using cost-effective processes. The BGA packages serve as modular building blocks that reduce the complexity and cost of direct chip attach while maintaining high mounting density through their standardized form factor and interconnection capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances reliability, reduces defects, and supports high-performance operation in higher temperature environments while maintaining cost-effectiveness and flexibility, enabling efficient manufacturing and integration of complex semiconductor devices.
Implementation Method 1
fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader
Implementation Method 2
the access port, which also serves as an EMI shield and thermal path
Data Source
AI summary
A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electrical interconnect between the integrated circuit die and the substrate; and coupling a second integrated circuit package to the substrate through the access port.