Multi-Layer BGA-to-PCB Interface to Limit Adjacent Pad Shorting

The elastomeric structure is divided into multiple layers (first elastomeric layer and second elastomeric layer) with different widths. The first layer has a first width and the second layer has a second width, allowing each layer to perform different functions in the conduction path. This segmentation enables optimization of conduction efficiency at different stages while maintaining structural manageability.

Different portions of the elastomeric structure have different widths tailored to specific locations. The first elastomeric layer has a wider first width for optimal contact with the solder ball, while the second elastomeric layer has a narrower second width for precise alignment with the contact pad. This local variation in geometry optimizes conduction efficiency at each interface.

The elastomeric structure is segmented into multiple layers with different widths. The first elastomeric layer has a first width optimized for solder ball contact, while the second elastomeric layer has a second width optimized for contact pad alignment. This segmentation allows the structure to achieve good conduction efficiency without excessive width that would cause shorting with adjacent pads.

The elastomeric structure has different widths at different locations and layers. The first width of the first elastomeric layer is wider to ensure good contact with the solder ball, while the second width of the second elastomeric layer is narrower to precisely match the contact pad dimensions and avoid adjacent pad shorting. This local quality variation resolves the contradiction between conduction efficiency and shorting prevention.

The elastomeric structure is divided into a first elastomeric layer and a second elastomeric layer, each with different widths. This segmentation allows for optimized conduction and shorting prevention while maintaining a relatively simple manufacturing process. Each layer can be formed using standard elastomeric fabrication techniques, and the layered structure can be assembled through conventional stacking and bonding methods.

The dual-width design with different elastomeric layer widths is integrated into the overall structure in a way that maintains manufacturing feasibility. The first elastomeric layer with first width and second elastomeric layer with second width can be manufactured using modified standard processes, where the width variations are incorporated during the elastomeric formation or assembly stages without requiring entirely new manufacturing approaches.