BGA Interconnection Reliability Testing via Simplified PCB Fixture
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Solution Overview
Problem
Conventional methods for testing the reliability of ball grid array (BGA) connections on integrated circuit (IC) packages are costly and time-consuming, requiring the design and production of a complete circuit board with peripheral components, which limits the effectiveness of reliability testing and increases the risk of component failure.
Innovation Solution
A method and apparatus that electrically connect an IC package with solder bumps to a standardized testing PCB, using IO and ground pads on the underside to test the reliability of solder bumps and balls by applying voltage, allowing for individual or simultaneous testing without the need for a daisy chain PCB, thereby reducing production costs and time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complete circuit board with peripheral components is built for reliability testing, then the testing can be conducted at system level, but the cost and time for fabrication increase significantly
Solution Approach 1:
The patent extracts only the essential testing functionality from a complete circuit board by using a simplified test fixture with probe cards that directly contact the BGA solder balls, eliminating the need to fabricate entire peripheral circuits and components while maintaining reliability testing capability
Solution Approach 2:
The patent creates a simplified copy of the circuit board's essential testing function through a test fixture that replicates the electrical connection paths needed for BGA reliability testing without duplicating the full board structure and components
2Reliability
If a complete circuit board with peripheral components is built for reliability testing, then the testing can be conducted at system level, but the fabrication cost increases
Solution Approach 1:
The patent extracts only the essential testing functionality from a complete circuit board by using a simplified test fixture with probe cards that directly contact the BGA solder balls, eliminating the need to fabricate entire peripheral circuits and components while maintaining reliability testing capability
Solution Approach 2:
The patent employs disposable or reusable probe cards and test fixtures that are significantly cheaper than complete circuit boards, allowing multiple testing cycles without the high fabrication costs associated with building entire system boards
3Reliability
If a daisy chain PCB is designed and built for BGA testing, then the reliability of solder joints can be tested, but the device complexity and production time increase
Solution Approach 1:
The patent extracts the essential BGA testing function from complex daisy chain PCB designs by using simple probe cards that directly contact solder balls, eliminating the need for specialized daisy chain circuitry while maintaining the ability to test solder joint reliability
Solution Approach 2:
The patent creates a universal test fixture that can test various BGA packages and configurations using the same basic probe card technology, eliminating the need for specialized daisy chain designs for each testing scenario
4Reliability
If a daisy chain PCB is designed and built for BGA testing, then the reliability of solder joints can be tested, but the production time increases
Solution Approach 1:
The patent extracts the essential BGA testing function from complex daisy chain PCB designs by using simple probe cards that directly contact solder balls, eliminating the need for specialized daisy chain circuitry while maintaining the ability to test solder joint reliability
Solution Approach 2:
The patent prepares test fixtures and probe cards in advance that can be quickly swapped between different BGA devices, allowing rapid sequential testing without the time-consuming process of designing and building specialized daisy chain PCBs for each test
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the product development cycle and board-level qualification time, detects most potential failure modes, and lowers the risk of component failure by enabling efficient and standardized testing of BGA reliability without the need for a full circuit board design.
Implementation Method 1
electrically connecting an IC package, having an IC die connected thereto by solder bumps, to an IC test region of a testing PCB by forming solder balls between bond pads of the IC package substrate and the testing PCB
Implementation Method 2
Each via has an IO pad or ground pad connected thereto. An IC package having an IC die connected thereto by solder bumps is connected to the IC test region by solder balls, such that each of the IO pads is connected to a respective pair of the solder balls and solder bumps by the vias
Data Source
AI summary
An apparatus for determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit is presented. The assembly comprises a testing printed circuit board (PCB) having an integrated circuit (IC) test region located thereon. Vias extend through the testing PCB from a surface to an underside thereof within the IC test region. Each via has an IO pad or ground pad electrically connectable thereto. An IC package having an IC die connected thereto by solder bumps is connected to the IC test region by solder balls, such that each of the IO pads is electrically connectable to a respective pair of the solder balls and solder bumps by the vias. A method of testing interconnection reliability of the BGA using the apparatus is also presented.