BGA Socket Contact Pin Design for Burn-in Test Stability
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Solution Overview
Problem
In semiconductor device burn-in tests, existing socket types for BGA (Ball Grid Array) devices face issues with flexibility and coplanarity due to substrate warping, leading to poor contact and pop-up phenomena, as horizontal-rib and vertical-rib types either restrict vertical movement or provide insufficient holding power.
Innovation Solution
A semiconductor device manufacturing method and structure that incorporates a socket with conductive contact pins featuring a first projection part extending along the attachment direction and a second projection part crossing it, ensuring contact with the ball electrode while preventing pop-up through orthogonal impressions on the ball electrodes, enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a horizontal-rib type contact pin is used, then the ball electrode is constrained horizontally, but the vertical flexibility of the ball electrode is reduced, disturbing substrate expansion and contraction
Solution Approach 1:
The contact pin tip is segmented into two distinct projection parts: a first projection part extending along the attachment direction for horizontal constraint, and a second projection part extending in the thickness direction for vertical support. This segmentation allows each part to independently fulfill its specific function without interfering with the other, resolving the contradiction between horizontal stability and vertical flexibility.
Solution Approach 2:
Different parts of the contact pin tip are given different functional qualities: the first projection part provides horizontal positioning and coplanarity control, while the second projection part provides vertical support and flexibility. This local differentiation of functional qualities allows the contact pin to simultaneously achieve both horizontal stability and vertical adaptability.
2Adaptability or versatility
If a vertical-rib type contact pin is used, then vertical support is provided, but the holding power of the ball electrode is weak, causing pop-up phenomenon and poor contact
Solution Approach 1:
The contact pin tip merges two projection parts into a single integrated structure: the first projection part extending along the attachment direction and the second projection part extending in the thickness direction. This merging combines the horizontal constraint function and vertical support function into one unified contact structure, achieving both stable contact and reliable holding power to prevent pop-up phenomenon.
3Ease of manufacture
If the contact pin structure is simplified, then manufacturing is easier, but the ability to maintain coplanarity and prevent pop-up is insufficient
Solution Approach 1:
The contact pin tip structure transitions from a single-dimension rib structure to a two-dimensional projection structure with components extending in both the attachment direction and the thickness direction. This dimensional enhancement provides dual-functionality (horizontal constraint and vertical support) while maintaining a relatively simple overall form that can be manufactured using conventional processes.
Data Source
AI summary
The present invention is directed to improve reliability of a semiconductor device. A semiconductor device manufacturing method includes: (a) a step of attaching a BGA having a solder ball to a socket for a burn-in test; and (b) a step of performing a burn-in test of the BGA by sandwiching the solder ball by conductive contact pins in the socket. The contact pin in the socket has a first projection part which is conductive and extends along an attachment direction of the BGA and a second projection part which is conductive, provided along a direction crossing the extension direction of the first projection part, and placed so as to face the surface on the attachment side of the BGA of the solder ball. In the step (b), a burn-in test of the BGA is performed in a state where the first projection parts in the contact pins are in contact with the solder ball.