BGA Spring Probe Pin Split Cylinder Design
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Solution Overview
Problem
Existing BGA spring probe pins face challenges in maintaining reliable electrical contact with solder balls of irregular sizes and shapes, leading to probe failures and increased maintenance needs.
Innovation Solution
The improved BGA spring probe pin features a spring actuated solder ball receptacle with a split cylinder design that grips the sides of the solder ball, providing consistent contact through a ball clamp spring mechanism, which compresses to ensure firm engagement with the split cylinder's increased surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cup shaped solder ball receptacle is used to contact solder balls, then electrical connection is established, but reliable contact is difficult to maintain with solder balls of irregular sizes and shapes
Solution Approach 1:
The receptacle is divided into a stationary outer cup-shaped structure and a movable inner split cylinder. The split cylinder can independently compress and expand to adapt to irregular solder ball shapes while the outer cup provides stable positioning. This segmentation allows each component to specialize: the outer cup handles positioning while the inner split cylinder handles adaptation to size and shape variations.
Solution Approach 2:
The inner split cylinder is made dynamic through spring actuation, allowing it to compress and expand based on the encountered solder ball dimensions. This dynamic capability enables the receptacle to maintain reliable electrical contact across varying solder ball sizes and shapes, directly resolving the adaptability-reliability contradiction.
2Reliability
If crown points are added to the rim of the cup shaped receptacle to increase pressure on solder balls, then more reliable electrical contact is achieved, but the device complexity increases
Solution Approach 1:
Instead of adding complex features like crown points to a single rigid structure, the invention segments the receptacle into movable and stationary parts. The pressure application function is separated and assigned to the spring-actuated split cylinder, which naturally provides compliant pressure without requiring additional geometric features.
Solution Approach 2:
The invention changes the operational parameters of the receptacle by introducing spring actuation and split cylinder geometry. This allows the structure to dynamically adjust its contact parameters (pressure, contact area) based on solder ball characteristics, achieving reliable contact without increasing structural complexity through features like crown points.
3Reliability
If a split cylinder design with ball clamp spring is used to grip solder balls, then consistent electrical contact is achieved, but the manufacturing complexity increases
Solution Approach 1:
The receptacle is segmented into manufacturable components: an outer cup, an inner split cylinder, and a spring assembly. Each component can be manufactured separately using standard processes, then assembled. This segmentation balances manufacturing ease with the ability to achieve consistent electrical contact through the coordinated action of components.
Solution Approach 2:
The spring actuated split cylinder is designed to self-adjust and self-regulate contact pressure through its mechanical design. The spring automatically provides the necessary clamping force without requiring complex control systems or additional adjustment mechanisms, maintaining manufacturing simplicity while ensuring contact consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances first pass yield, reduces probe failures, and decreases maintenance time by ensuring reliable electrical contact and reducing the need for re-probing and part replacement.
Implementation Method 1
a spring actuated solder ball receptacle with a split cylinder design that grips the sides of the solder ball during probing
Implementation Method 2
A ball clamp spring mechanism, which compresses to ensure firm engagement with the split cylinder's increased surface area
Data Source
AI summary
An improved BGA spring probe pin with a spring actuated solder ball receptacle that grips the sides of the solder ball during probing. A method of operating a BGA prober with improved BGA spring probe pins.