Ball Grid Array Package Stacking with Heat Spreader Access Port
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in integrated circuit packaging is to enhance the capabilities of ball grid array packaging to address issues of heat management, increased complexity, and defect rates in multi-chip modules, while maintaining cost-effectiveness and performance in high-density semiconductor devices.
Innovation Solution
A ball grid array package stacking system is developed, involving a base substrate, a stacking substrate, a heat spreader with access ports, and a stacked integrated circuit, which allows for efficient heat dissipation and additional component attachment, using thermal adhesives and electrical interconnects to maximize yield and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple die are placed within a single package to increase functionality, then device complexity and functionality are improved, but defect rates increase and reliability decreases
Solution Approach 1:
The patent divides the multi-chip module into separate package units, each containing a single die or fewer dies. This segmentation allows individual testing and sorting of each package before final assembly, so that defective units can be identified and removed without compromising the entire module. The system uses multiple smaller packages (e.g., two separate packages instead of one large package) to achieve the same functionality while improving yield and reliability.
2Quantity of substance
If multiple die are stacked vertically to increase density, then integration density is improved, but heat management becomes more difficult
Solution Approach 1:
The patent transitions from vertical stacking to horizontal arrangement of multiple packages on the PCB. Instead of stacking die vertically which creates heat accumulation, the system places multiple smaller packages side-by-side on the same plane. This dimensional change allows each package to have its own thermal management and enables heat to dissipate across a larger surface area, effectively solving the heat dissipation problem while maintaining high integration density.
3Device complexity
If a single large package is used to reduce the number of components, then device complexity is reduced, but manufacturing precision and defect detection become more difficult
Solution Approach 1:
The patent segments the system into multiple smaller, standardized packages instead of using one large custom package. Each small package can be manufactured, tested, and sorted independently with higher precision. The segmentation enables defect detection at the individual package level before final assembly, making it easier to identify and isolate defective units without having to inspect an entire large package.
4Quantity of substance
If direct chip attach is used to achieve the most effective packaging, then integration density is improved, but cost and manufacturing complexity increase
Solution Approach 1:
The patent introduces standardized packages as intermediary components between the bare die and the PCB. Instead of directly attaching chips to the board (which requires expensive fine-line PCBs and complex assembly), the system uses intermediate package substrates that can be manufactured more economically. These packages serve as mediators, providing mechanical support, electrical interconnection, and thermal management while enabling the use of less expensive PCBs and simpler assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat in stacked packages, supports further component attachment, reduces defects, and maintains cost-effectiveness, enhancing performance and yield in high-density semiconductor devices.
Implementation Method 1
mounting a heat spreader, having an access port, around the base substrate and the stacking substrate
Data Source
AI summary
A method for manufacturing a ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate; coupling a stacking substrate over the base substrate; mounting a heat spreader, having an access port, around the base substrate and the stacking substrate; and coupling a stacked integrated circuit to the stacking substrate through the access port.