BGA Terminal Group Layout for Lower Crosstalk IC Packaging
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Solution Overview
Problem
Semiconductor integrated circuit devices with BGA architecture face challenges in reducing electrical crosstalk and size increase due to high-density terminal arrangements, which are exacerbated by the demand for advanced multi-functionality and increased signal propagation.
Innovation Solution
The implementation of a ball grid array with a first and second ball grid group, where the first ball grid group provides electric coupling between the first circuit block and the first external circuit, and the second ball grid group does the same for the second circuit block, with the first ball grid group having a larger number of terminals and a shorter distance to the side, and the second ball grid group having fewer terminals and a longer distance, optimizing terminal placement to reduce crosstalk and size growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of terminals is increased to support multi-functionality, then the functionality of the semiconductor integrated circuit device is improved, but the risk of electrical crosstalk increases
Solution Approach 1:
The ball grid array is divided into multiple groups (first ball grid group, second ball grid group, third ball grid group) with different arrangements and functions. This segmentation allows high-speed signal terminals to be separated from power supply terminals, reducing electrical crosstalk while maintaining the ability to support multiple functions through the distributed terminal groups.
Solution Approach 2:
Different regions of the ball grid array are assigned different properties: the first ball grid group uses narrow pitch for high-density signal transmission, the second ball grid group uses wide pitch for stable power supply, and the third ball grid group provides shielding. This local differentiation optimizes each region for its specific function while reducing overall crosstalk.
2Quantity of substance
If the pitch between terminals is reduced to increase terminal density, then the number of terminals per unit area is improved, but the risk of electrical crosstalk increases
Solution Approach 1:
The terminal array is segmented into different pitch regions: narrow pitch areas for high-density signal terminals and wide pitch areas for power supply terminals. This allows maximum terminal density where needed while maintaining sufficient spacing to prevent crosstalk in power supply regions.
Solution Approach 2:
A third ball grid group consisting of ground terminals is introduced as an intermediary shielding layer between signal terminals and power supply terminals. This intermediary structure blocks electrical crosstalk while allowing both high-density signal terminals and wide-spaced power terminals to coexist in the same array.
3Ease of manufacture
If terminals are arranged in a uniform grid pattern, then the manufacturing process is simplified, but the ability to reduce crosstalk in high-speed signal paths is limited
Solution Approach 1:
The uniform grid pattern is segmented into distinct functional zones: signal terminal groups with optimized spacing, power supply terminal groups with different spacing, and ground terminal groups for shielding. This maintains the simplicity of grid-based manufacturing while enabling differentiated terminal arrangements to reduce crosstalk.
Solution Approach 2:
While maintaining an overall grid structure for ease of manufacture, the invention introduces asymmetric variations in local areas: different pitch dimensions in different groups, non-uniform distribution of ground terminals for optimal shielding, and varied group positions. This allows crosstalk reduction while preserving manufacturing simplicity.
Data Source
AI summary
An electronic apparatus includes an integrated circuit board; a printed circuit board electrically coupled to first and second external circuits; and a ball grid array that couples the integrated circuit board and the printed circuit board, includes a first group including pieces of first ball grid, and includes a second group including pieces of second ball grid. The first group couples the first circuit block and the first external circuit. The second group couples the second circuit block and the second external circuit. The number of the pieces of first ball grid is larger than the number of the pieces of second ball grid. The minimum distance between the first group and the first side is shorter than the minimum distance between the group and the first side and is shorter than the minimum distance between the second group and the second side.