Bi-directional Substrate Transfer Device for Semiconductor Processing

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Solution Overview

Problem

Existing substrate processing systems with multi-chamber structures face efficiency issues due to increased load on transferring robots and larger transfer chamber sizes, leading to reduced yield and increased maintenance time.

Innovation Solution

A substrate processing system with a bi-directional substrate transferring device that moves horizontally between two rows of linearly arranged processing chambers, utilizing a moving unit, bi-directional substrate transferring unit, and rotating unit to transfer substrates through sliding movements and precise angle rotations, eliminating the need for robot rotation and optimizing space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a cluster type substrate processing system with a transferring robot is used to transfer substrates between processing chambers, then substrate transfer capability is provided, but the yield is lowered due to increased load on the transferring robot

Engineering Contradiction:
Improvesubstrate transfer capabilityVSAvoidyield
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The substrate transfer system is segmented into multiple independent linear motors (first linear motor for radial direction, second linear motor for axial direction) that operate separately to transfer substrates. This segmentation distributes the transfer load across multiple independent actuators rather than relying on a single rotating robot, thereby reducing mechanical stress and improving transfer reliability and substrate yield.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If space for rotation of the transferring robot is ensured, then substrate transfer is enabled, but the transfer chamber is increased in size, whereby maintenance time is increased

Engineering Contradiction:
Improvesubstrate transfer capabilityVSAvoidtransfer chamber size
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

Instead of using a traditional rotating robot mechanism that requires radial space for rotation, the patent inverts the approach by using linear motors that move substrates in straight lines (radial and axial directions). This eliminates the need for rotational space, reducing the transfer chamber size while maintaining full substrate transfer capability between all processing chambers.

Inventive Principle:
Principle #13The other way round (Inversion)

3Ease of manufacture

If a traditional rotating robot mechanism is used for substrate transfer, then substrate loading and unloading is achieved, but the transfer chamber size is increased, leading to increased maintenance time

Engineering Contradiction:
Improvesubstrate loading and unloading capabilityVSAvoidmaintenance time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The patent replaces the traditional mechanical rotating robot system with an electric linear motor system. The first linear motor transfers substrates in the radial direction, and the second linear motor transfers them in the axial direction. This substitution eliminates complex mechanical rotating components, reducing the transfer chamber size and maintenance requirements while maintaining ease of substrate loading and unloading.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9252034B2Substrate processing system and substrate transferring method
Publication Date: 2016.02.02 JUSUNG ENG
  • US9252034B2 patent drawing
  • US9252034B2 patent drawing
  • US9252034B2 patent drawing

AI summary

A substrate processing system and substrate transferring method is capable of improving substrate-transferring efficiency by transferring a substrate bi-directionally through a substrate transferring device between two rows of processing chambers, and transferring the substrate to a precise position by rotating the substrate transferring device. The processing system includes a transfer chamber, a bi-directional substrate transferring device; and processing chambers which apply a semiconductor-manufacturing process to the substrate. The processing chambers are linearly arranged along two confronting rows, and the transfer chamber is between the two rows of processing chambers. The substrate transferring device includes a moving unit inside the transfer chamber; a bi-directional substrate transferring unit in the moving unit, that transfers the substrate to the processing chamber through a bi-directional sliding movement; and a rotating unit between the moving unit and the bi-directional substrate transferring unit, that rotates the bi-directional substrate transferring unit at a predetermined angle.