Bi-material LED Optical Element Thermal Management
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Solution Overview
Problem
Existing LED-based lighting systems face challenges in achieving optimal optical efficiency, thermal management, and durability due to material limitations that compromise both optical and thermal properties.
Innovation Solution
A bi-material transmitting optical element is developed, where the light pipe is made from a thermoplastic material optimized for optical efficiency, and the fixation assembly is made from a thermally conductive material like aluminum or its alloy, allowing for improved thermal management and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light pipe is made from a single material optimized for optical efficiency, then optical efficiency is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent applies composite materials by creating a bi-material structure where the light pipe is made from a thermoplastic material optimized for optical efficiency while the fixation assembly is made from a thermally conductive material like aluminum or its alloy. This composite approach allows each material to perform its specialized function - the thermoplastic handles light transmission while the aluminum handles heat dissipation - thereby resolving the contradiction between optical efficiency and thermal management capability.
2Temperature
If the fixation assembly is made from a thermally conductive material, then thermal management is improved, but optical efficiency deteriorates
Solution Approach 1:
The patent applies segmentation by dividing the lighting assembly into distinct functional components: the light pipe made from thermoplastic material for optical efficiency and the fixation assembly made from thermally conductive material for thermal management. This segmentation allows each component to be optimized for its specific function without compromising the other, as the thermally conductive fixation assembly does not need to transmit light while the thermoplastic light pipe focuses on light transmission.
3Illumination intensity
If a bi-material structure is used, then thermal management and optical efficiency are both improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies merging by integrating the light pipe and fixation assembly into a single molded component rather than assembling separate parts. The bi-material injection molding process allows both materials to be combined in one manufacturing step, creating a unified structure that eliminates the need for separate assembly operations. This merging approach reduces manufacturing complexity despite using multiple materials, as the entire bi-material structure is produced in a single molding cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This bi-material approach enhances the optical efficiency and thermal performance of LED-based lighting systems, enabling brighter and more efficient light output while maintaining durability and reliability.
Implementation Method 1
made of material with high optical efficiency
Implementation Method 2
the heat sink is formed from a thermally conductive material... the thermally conductive material is at least one of aluminum and an aluminum alloy
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3C
AI summary
A lighting assembly having a mounting structure (104), an LED (102) mounted on the mounting structure (104), an optical device (110) optically coupled to the LED (102), and a support structure (128) for connecting the optical device (110) to the mounting structure (104). The LED (102) is enclosed within a space formed by the mounting structure (102), the support structure (128), and the optical device (110). The support structure (128) absorbs thermal energy to reduce an operating temperature of the optical device (110). The optical device (110) may be formed from a first material and the support structure (128) may be formed from a different, second material.