Bi-Phase Refrigerant Temperature Forcing for Direct Evaporator Cooling
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Solution Overview
Problem
Existing temperature forcing systems for semiconductor chips and modules face inefficiencies due to two heat exchangers in tandem, low heat dissipation rates, and high heat capacity of circulating fluids, limiting temperature control accuracy and switching speed.
Innovation Solution
A bi-phase refrigerant-based system with a central unit, temperature-forcing heads, and a compressor that circulates refrigerant in a closed loop, allowing direct evaporation for cooling and heating, reducing heat transfer stages and enhancing thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional refrigeration system with two heat exchangers is used, then the device can be cooled, but the cumulative temperature differential reduces cooling efficiency and limits how low the temperature can be forced
Solution Approach 1:
The patent extracts the intermediate heat exchanger from the cooling system, eliminating the second heat exchanger that caused cumulative temperature differential. The refrigerant now contacts the device casing directly, removing the inefficient heat transfer interface and enabling lower temperatures with better efficiency.
Solution Approach 2:
The patent creates an asymmetric heat transfer path where the refrigerant flows directly from the expansion device to the device casing, bypassing the symmetric two-exchanger arrangement. This asymmetric direct contact configuration eliminates the temperature differential accumulation that occurs in conventional symmetric multi-exchanger systems.
2Speed
If Fluid Forced Heat convection is used in the heat exchanger, then heat transfer occurs, but the low heat transmission factors seriously limit the rate at which the device temperature may be changed
Solution Approach 1:
The patent utilizes phase transition of the refrigerant (expansion from liquid to vapor) directly at the device casing surface. This phase change process provides intense heat transfer with high transmission factors, enabling rapid temperature changes without the limitations of conventional fluid forced convection.
Solution Approach 2:
The patent employs refrigerant fluid dynamics, using the expansion and phase change of the refrigerant gas directly at the heat transfer surface. This pneumatic approach with phase-changing fluid provides superior heat transmission factors compared to conventional liquid-based forced convection systems.
3Device complexity
If a single-stage refrigeration system is used, then the system is simple, but the relatively large cumulative temperature differential places an unacceptable limit on how low the temperature may be forced
Solution Approach 1:
The patent removes the intermediate heat exchanger that caused the cumulative temperature differential problem in single-stage systems. By extracting this component, the system maintains its single-stage simplicity while achieving lower forcing temperatures without the temperature loss associated with multiple heat transfer interfaces.
4Loss of time
If the refrigerant circulation system uses conventional heat exchangers, then heat transfer occurs, but the relatively large heat capacity of the circulating transfer fluid limits the rate at which the temperature may be switched
Solution Approach 1:
The patent utilizes rapid phase transition of the refrigerant directly at the device casing, which occurs much faster than conventional heat exchanger heat transfer. This phase change mechanism dramatically reduces the temperature switching time by eliminating the thermal mass limitation of large-volume liquid transfer fluids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system achieves faster and more accurate temperature control, enabling lower temperatures with less powerful refrigeration and quicker switching between extreme temperatures, improving overall thermal efficiency and operational flexibility.
Implementation Method 1
the refrigerant is made to flow through the evaporator, where it is made to evaporate and dissipate heat therefrom
Implementation Method 2
When passing through the thermal head's heat exchanger, the transfer fluid extracts heat from the thermal head, thus, in turn, cooling it
Implementation Method 3
a compressor...configured to compress the refrigerant to high pressure
Implementation Method 4
a condenser...configured to dissipate heat from the refrigerant and condense it to liquid form
Implementation Method 5
Through the heat exchanger, the refrigerant is dissipated to the atmosphere or to another cooling medium
Implementation Method 6
an expansion valve...configured to reduce the pressure of the refrigerant from high pressure to low pressure
Implementation Method 7
a thermal head...placeable in thermal contact with the device under test...When passing through the thermal head's heat exchanger, the transfer fluid extracts heat from the thermal head
Data Source
AI summary
A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising—a temperature-forcing head, including a face configured to be put in thermal contact with the device and an evaporator, in direct or indirect thermal contact with the face; anda refrigerant circulation subsystem, including a compressor, a condenser and a metering device;wherein the subsystem is configured to circulate a bi-phase refrigerant, in closed loop fashion, through the evaporator so that, during circulation, the refrigerant is maintained at high pressure between the compressor and the metering device and at low pressure while flowing through the evaporator.More specifically, in the disclosed system the refrigerant, while flowing through the evaporator at a low pressure, is operative to dissipate heat therefrom by evaporation and the evaporator or any part thereof is formed as a heat exchanger.