Efficient temperature forcing of semiconductor devices under test
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Solution Overview
Problem
Existing temperature forcing systems for semiconductor devices are inefficient due to multiple heat exchangers, low heat transfer rates, and high thermal inertia, limiting the accuracy and speed of temperature control across extreme temperature ranges.
Innovation Solution
A bi-phase refrigerant-based temperature forcing system with a central unit and thermal heads that utilize direct evaporation for cooling, reducing heat transfer stages and incorporating a thermoelectric cooler for precise temperature control, allowing rapid switching between high and low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat exchangers are used in the temperature forcing system, then the system can achieve temperature control across extreme ranges, but the thermal efficiency decreases and thermal inertia increases
Solution Approach 1:
The patent removes the intermediate heat exchanger from the conventional two-exchanger configuration, creating a direct thermal contact between the refrigerant circulation system and the device under test. This extraction of the intermediary component eliminates the cumulative temperature differential and reduces thermal inertia, directly resolving the contradiction between temperature range capability and thermal efficiency.
2Device complexity
If a single-phase transfer fluid is used in heat exchangers, then the system structure is simple, but the heat transfer rate is low
Solution Approach 1:
The patent employs a bi-phase refrigerant that undergoes phase transition between liquid and vapor states within the thermal head. This phase change mechanism provides extremely high heat transfer coefficients compared to single-phase fluid convection, enabling rapid heat extraction or supply while maintaining a relatively simple system structure through direct immersion of the refrigerant in the thermal head.
3Stability of the object's composition
If a large volume of heat transfer fluid is circulated, then the system can maintain stable temperature, but the temperature switching speed decreases
Solution Approach 1:
The bi-phase refrigerant system utilizes the latent heat of vaporization and condensation to provide large thermal energy transfer with minimal fluid volume. The phase transition occurs rapidly at the thermal head interface, enabling fast temperature switching while the refrigerant circulation maintains temperature stability through controlled phase change rates, thus resolving the contradiction between stability and switching speed.
4Temperature
If conventional refrigeration systems are used, then the system can achieve low temperatures, but the device complexity and size increase
Solution Approach 1:
The patent merges the refrigerant storage, heat exchange, and circulation functions into a single integrated thermal head assembly. The refrigerant is stored in and circulates through the thermal head itself, combining what would traditionally be separate components (refrigerant reservoir, heat exchanger, circulation pump) into one unified device, thereby achieving low temperatures while reducing overall system complexity and size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system achieves faster and more accurate temperature control, enabling temperature switching rates of 50-150°C per minute with improved thermal efficiency and reduced thermal inertia, effectively addressing the limitations of prior art systems.
Implementation Method 1
the refrigerant is caused to flow through the evaporator in a liquid state, whereat it evaporates as a result of heat transfer from the device, thus cooling the device
Implementation Method 2
it evaporates as a result of heat transfer from the device
Implementation Method 3
incorporating a thermoelectric cooler for precise temperature control
Implementation Method 4
a compressor, a condenser, a flow control device for inducing a pressure drop in said refrigerant
Data Source
AI summary
A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.