Power Amplifier Bias Circuit Using Dual-Range Gain Compensation

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Solution Overview

Problem

Power amplifiers in communication systems face challenges with low thermal stability, leading to complex peripheral circuits and increased module size, which hinders miniaturization.

Innovation Solution

A gain compensation device incorporating high-temperature and low-temperature compensation units, which receive a compensation signal to determine a compensation gear and generate a bias current to adjust the gain of the power amplifier, improving thermal stability while minimizing circuit complexity and space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If off-chip components are used to control bias current or input voltage for gain compensation, then thermal stability is improved, but device complexity and module space increase

Engineering Contradiction:
Improvethermal stabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the gain compensation function from external off-chip components and integrates it into the power amplifier chip itself. The compensation unit is built using transistors and resistors that are fabricated on the same chip, eliminating the need for external components while maintaining the temperature compensation capability. This resolves the contradiction by removing external components (reducing complexity and space) while preserving the thermal stability improvement.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the gain compensation function with the power amplifier circuit by integrating the compensation unit directly on the chip. The compensation unit shares the same substrate and power supply as the main amplifier, combining multiple functions into a single integrated structure. This integration reduces device complexity and module space while maintaining thermal stability performance.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If off-chip components are used for gain compensation, then thermal stability is improved, but module space increases

Engineering Contradiction:
Improvethermal stabilityVSAvoidmodule space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent removes external off-chip compensation components and extracts the compensation function onto the chip itself. By using on-chip transistors and resistors instead of external components, the module space is significantly reduced while the thermal stability compensation function remains intact. This directly addresses the space constraint by eliminating external component requirements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The compensation unit is nested within the power amplifier chip structure, with compensation transistors and resistors integrated into the same chip real estate. The compensation circuit is embedded within the existing amplifier architecture, utilizing shared substrates and power domains, thereby minimizing additional space requirements while achieving thermal stability improvement.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Measurement precision

If multiple compensation units are used to cover different temperature ranges, then compensation accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvecompensation accuracyVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the temperature compensation range into multiple zones by using different compensation units for different temperature ranges. Each compensation unit is designed to operate effectively in a specific temperature range, with switching logic that activates the appropriate unit based on detected temperature conditions. This segmentation improves compensation accuracy across the full temperature spectrum while managing complexity through modular design and conditional activation.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11843358B2Gain compensation device and bias circuit device
Publication Date: 2023.12.12 RADROCK (CHONGQING) TECHNOLOGY CO LTD
  • US11843358B2 patent drawing
  • US11843358B2 patent drawing

AI summary

Provided are a gain compensation device and a bias circuit device. A compensation bias current is generated by the gain compensation device to compensate the gain deviation of power amplifier and improve stability of power amplifier. Through high-temperature compensation unit and low-temperature compensation unit in different gears, gain of power amplifier is compensated along with temperature changes, thereby improving feasibility of the gain compensation device. It takes small space, and the circuit only includes the circuits corresponding to high-temperature compensation unit and low-temperature compensation unit, so the circuit is relatively simple and beneficial to miniaturization. In the bias circuit device, based on an initial bias current provided by a bandgap reference, the gain compensation device is added to generate a compensation bias current, and the initial bias current and compensation bias current are superimposed, so that the gain of power amplifier is further compensated, which improves stability of power amplifier.