Bias Supply Impedance Feedback for Consistent Plasma Etching

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Solution Overview

Problem

Current techniques for controlling bias power in plasma processing rely on inaccurate assumptions or predictions of capacitances in the plasma chamber, leading to unpredictable ion trajectories and inconsistent etching profiles.

Innovation Solution

A system that dynamically controls the ramp voltage of the bias supply based on real-time impedance indicators, using sensors to monitor power reflection and adjust the bias waveform to maintain consistent ion energy levels without relying on chamber capacitance measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If bias power control relies on assumptions or predictions of chamber capacitances, then the control system is simple, but the etching profile consistency deteriorates

Engineering Contradiction:
Improvecontrol system complexityVSAvoidetching profile consistency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The system measures actual chamber impedance during plasma processing and uses this real-time feedback to adjust bias power delivery. The controller continuously monitors impedance changes and modifies the bias waveform accordingly, replacing static capacitance assumptions with dynamic measurement-based control, thereby achieving consistent etching profiles across different chambers.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If real-time impedance measurement is implemented, then etching profile consistency improves, but device complexity increases

Engineering Contradiction:
Improveetching profile consistencyVSAvoidmeasurement and control system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The plasma chamber itself provides the measurement signal through its inherent impedance characteristics during normal operation. The system uses the existing plasma discharge and power delivery infrastructure to extract impedance information, eliminating the need for separate measurement devices or additional sensors, thus reducing overall system complexity while achieving precise control.

Inventive Principle:
Principle #25Self-service

3Manufacturing precision

If chamber impedance is dynamically measured and used for control, then processing accuracy improves, but processing time increases

Engineering Contradiction:
Improveprocessing accuracyVSAvoidmeasurement and adjustment time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The impedance measurement and bias power adjustment occur continuously during plasma processing without interrupting the etching operation. The controller monitors impedance in real-time and makes continuous adjustments to the bias waveform, ensuring that processing accuracy is maintained throughout the entire process without requiring separate measurement or calibration steps that would consume additional time.

Inventive Principle:
Principle #20Continuity of useful action

Data Source

PatentUS20250279268A1Plasma processing based on bias supply reporting
Publication Date: 2025.09.04 ADVANCED ENERGY IND INC
  • US20250279268A1 patent drawing
  • US20250279268A1 patent drawing
  • US20250279268A1 patent drawing

AI summary

A generator to provide a source waveform, and a controller configured to receive a signal indicative of power reflected to the generator, receive timing information from a bias supply, and provide a report of the impedance based upon the bias waveform information.