Biasable Gas Distribution Plate for Low-Damage Plasma Preclean
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Solution Overview
Problem
Current substrate processing systems lack the necessary control to clean substrates effectively without causing damage, particularly in removing residues like etch residues and oxides using plasma species.
Innovation Solution
A substrate processing system incorporating a biasable gas distribution plate with perforations and a supporting structure that controls plasma species flow between volumes, utilizing a biasable gas distribution plate and RF power sources to manage plasma generation and distribution, minimizing damage to fragile semiconductor structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma species are used to clean substrate residues, then cleaning effectiveness is improved, but damage to fragile semiconductor structures increases
Solution Approach 1:
The gas distribution plate has non-uniform perforation patterns with different densities in different regions, creating localized variations in plasma species flux. This allows aggressive cleaning where needed while protecting sensitive areas, resolving the contradiction between cleaning effectiveness and substrate damage.
Solution Approach 2:
The bias voltage applied to the gas distribution plate is dynamically adjusted during processing to control the repulsion of plasma species. By changing the voltage parameter, the system can modulate plasma species flux to achieve effective cleaning while minimizing damage to fragile structures.
2Productivity
If plasma species flux is increased to improve cleaning, then residue removal is enhanced, but ion bombardment damage increases
Solution Approach 1:
Different regions of the gas distribution plate have different perforation densities, creating zones with varying plasma species flux. This allows high flux for efficient residue removal in some areas while maintaining low flux to protect sensitive structures in other areas.
Solution Approach 2:
The biasable gas distribution plate acts as an intermediary between the plasma source and substrate, using electric field control to regulate plasma species flux. This mediator function allows decoupling of cleaning effectiveness from ion bombardment damage.
3Ease of operation
If uniform plasma distribution is used, then processing simplicity is maintained, but control precision over plasma species flux decreases
Solution Approach 1:
The gas distribution plate incorporates non-uniform perforation patterns with varying densities across different regions, enabling precise local control of plasma species flux while maintaining a relatively simple overall plate structure.
Solution Approach 2:
The gas distribution plate is biasable, allowing dynamic adjustment of plasma species flux control during processing. This adds a temporal dimension to the spatial non-uniformity, enhancing control precision without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables precise control over plasma species distribution, effectively cleaning substrates while reducing damage to low-K materials during preclean processes.
Implementation Method 1
The radio frequency (RF) power source coupled to an electrode, wherein the electrode is configured to generate a plasma in the first volume during processing in the process chamber when an RF signal is provided from the RF power source to the electrode
Implementation Method 2
The first power source coupled to the biasable gas distribution plate and configured to electrically bias the biasable gas distribution plate relative to a ground
Data Source
AI summary
Embodiments of the disclosure include a substrate processing system, comprising a biasable gas distribution plate disposed between a first volume and a second volume of a process chamber, wherein the biasable gas distribution plate comprises a first surface facing the first volume, a second surface facing the second volume, disposed opposite of the first surface, and a plurality of perforations extending between the first surface and the second surface. Some of the embodiments of the present disclosure provided herein provides an apparatus and method for performing a preclean process that utilizes a biasable gas distribution plate and supporting structure to enable preclean processes that can utilize chemically reactive reduction processes and/or physical sputtering processes as required by a particular device processing application.