Biased Detector Sub-Module Layout for Consistent CT Pixel Geometry
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing CT detector modules face issues with large stacking height differences due to components like substrates, biased analog-to-digital converters, and protective tungsten plates, leading to inconsistent pixel sizes and image processing complexity, affecting accuracy and reliability.
Innovation Solution
A biased detector sub-module design with a photoelectric conversion array and biased analog-to-digital converter arranged in the Z direction, where the biased analog-to-digital converter is adjacent to the photoelectric conversion array, and the substrate is partially overlapped to minimize height differences, using high-rigidity materials and a protective plate for radiation shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If biased detector sub-modules are stacked in the Z direction to form a detector module with large coverage area, then the coverage area is improved, but the stacking height difference increases causing inconsistent pixel sizes
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking in the Z direction, enabling larger coverage area while managing height differences through precise positioning. The detector sub-modules are arranged in multiple layers along the Z axis, with each layer offset to maintain consistent effective detection area while expanding overall coverage.
Solution Approach 2:
The patent adjusts the stacking parameters including the offset distance between layers and the positioning of detector elements to compensate for height differences. By carefully controlling the Z-direction offsets and using adjustable mounting mechanisms, the system maintains consistent pixel size equivalence across all layers despite physical height variations.
2Adaptability or versatility
If multiple components (substrate, biased analog-to-digital converter, protective tungsten plate, thermal conductive adhesive) are stacked, then the functional completeness is improved, but the stacking height difference increases
Solution Approach 1:
The patent implements a nested structure where the biased analog-to-digital converter is integrated within or adjacent to the substrate, and the protective tungsten plate is positioned to overlap with underlying components. This nesting approach consolidates multiple functional layers into a compact vertical arrangement, reducing overall stacking height while maintaining all necessary functions.
Solution Approach 2:
The patent utilizes the Z direction for stacking components while employing lateral offsets and overlapping arrangements to minimize the effective height contribution of each layer. By arranging components in three-dimensional space rather than simple vertical stacking, the system achieves functional completeness with reduced overall height difference.
3Adaptability or versatility
If the biased analog-to-digital converter is positioned away from the photoelectric conversion array, then the layout flexibility is improved, but the wire length and overall height increase
Solution Approach 1:
The patent merges the biased analog-to-digital converter with the photoelectric conversion array by positioning them adjacent to each other in the Z direction with lateral overlap. This integration eliminates the need for long connecting wires, reduces signal transmission distance, and allows the converter to be effectively part of the detection element assembly, achieving both compactness and layout flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces pixel size inconsistencies, simplifies image processing, and enhances image accuracy and reliability by minimizing height differences and background noise, improving signal quality and detector module stability.
Implementation Method 1
a photoelectric conversion array, a biased analog-to-digital converter
Data Source
AI summary
A biased detector sub-module, a detector module, a detector, and a medical imaging device are provided. The biased detector sub-module includes a photoelectric conversion array, a biased analog-to-digital converter, and a substrate. The biased analog-to-digital converter is electrically connected to the photoelectric conversion array. The substrate includes a mounting substrate and a circuit connection substrate stacked in a Y direction. The circuit connection substrate is electrically connected to the biased analog-to-digital converter. The photoelectric conversion array and the biased analog-to-digital converter are sequentially disposed in the Z direction at a side of the mounting substrate facing away from the circuit connection substrate. The biased analog-to-digital converter is adjacent to an end portion of the mounting substrate overlapping with the circuit connection substrate. A part of the mounting substrate that is not overlapped with the circuit connection substrate is configured to be stacked on an adjacent biased detector sub-module.