Biased Detector Sub-Module Stacking for Consistent CT Pixels
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Solution Overview
Problem
Existing CT detector modules experience a large stacking height difference (ΔH) due to components like the substrate, biased analog-to-digital converter, and protective tungsten plate, leading to inconsistent pixel sizes at the scanning center, increasing image processing complexity and reducing accuracy and reliability.
Innovation Solution
The biased detector sub-module design arranges the photoelectric conversion array and biased analog-to-digital converter in the Z direction, with a mounting substrate partially overlapping the circuit connection substrate to minimize height differences, using high-rigidity materials and a compact structure to ensure consistent pixel sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If biased detector sub-modules are stacked in the Z direction to form a detector module with large coverage area, then the coverage area is improved, but the stacking height difference increases causing pixel size inconsistency
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, utilizing the Z-direction (depth dimension) to arrange multiple photoelectric conversion arrays at different depths. This allows the detector module to achieve large coverage area while maintaining consistent pixel sizes by carefully controlling the stacking heights and using high-rigidity substrates to minimize height differences between layers.
2Adaptability or versatility
If multiple components (substrate, biased analog-to-digital converter, protective tungsten plate, thermal conductive adhesive) are stacked, then functional completeness is improved, but the stacking height difference increases
Solution Approach 1:
The patent combines multiple functional components (photoelectric conversion array, biased analog-to-digital converter, protective structures) into an integrated stacked assembly where each component serves multiple purposes. For example, the substrate provides both mechanical support and electrical connection functions, while the protective tungsten plate provides both radiation shielding and structural reinforcement, thereby reducing the need for separate dedicated components that would increase overall height.
Solution Approach 2:
The patent employs high-rigidity substrate materials with controlled thickness parameters to minimize height differences between stacked layers. By carefully selecting and controlling the thickness parameters of each component layer, the system achieves functional completeness while maintaining consistent pixel sizes across the detector module.
3Manufacturing precision
If stacking height difference is reduced to ensure consistent pixel sizes, then image accuracy is improved, but structural design complexity increases
Solution Approach 1:
The patent divides the detector module into multiple discrete stacked sub-modules, each with standardized interfaces and controlled height parameters. This segmentation allows for modular assembly where each unit can be independently manufactured and tested, reducing overall structural design complexity while maintaining precise pixel size consistency through standardized stacking protocols.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the influence of pixel size differences, simplifies image processing, and enhances the accuracy and reliability of CT images by minimizing height discrepancies between detector layers.
Implementation Method 1
a photoelectric conversion array, a biased analog-to-digital converter
Data Source
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AI summary
A biased detector sub-module, a detector module, a detector, and a medical imaging device are provided. The biased detector sub-module includes a photoelectric conversion array, a biased analog-to-digital converter, and a substrate. The biased analog-to-digital converter is electrically connected to the photoelectric conversion array. The substrate includes a mounting substrate and a circuit connection substrate stacked in a Y direction. The circuit connection substrate is electrically connected to the biased analog-to-digital converter. The photoelectric conversion array and the biased analog-to-digital converter are sequentially disposed in the Z direction at a side of the mounting substrate facing away from the circuit connection substrate. The biased analog-to-digital converter is adjacent to an end portion of the mounting substrate overlapping with the circuit connection substrate. A part of the mounting substrate that is not overlapped with the circuit connection substrate is configured to be stacked on an adjacent biased detector sub-module.