Biasing Cooling Apparatus for Stable LSI Contact
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Solution Overview
Problem
Existing cooling devices for LSIs face challenges in efficiently cooling high heat-generating components while allowing for the mounting of other components around the LSI, maintaining stable contact under varying postures, and preventing airflow obstruction.
Innovation Solution
A cooling device with a heat receiving portion, a columnar portion, and a base with biasing means to maintain stable contact, supported by a closed-loop liquid coolant system and a fan for enhanced airflow, allowing for the integration of additional components and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a liquid-cooling module is fixed to the board at its contact portion with the LSI, then the cooling function is provided, but the liquid-cooling module having a great weight will oscillate around a fulcrum on the LSI when the entire apparatus is moved, causing unstable contact between the LSI and the heat receiving portion and dropping cooling efficiency
Solution Approach 1:
The patent applies beforehand cushioning by introducing a resilient member (such as a spring or rubber element) between the heat receiving portion and the LSI contact surface. This resilient member is designed to absorb shocks and vibrations that occur when the apparatus is moved, preventing the heat receiving portion from detaching or oscillating excessively. The cushioning element maintains continuous contact pressure on the LSI while accommodating movement-induced disturbances, thereby ensuring stable cooling efficiency throughout operation.
2Reliability
If the liquid-cooling module is made with more components (radiator, pump, reserve tank) to improve cooling capacity, then the cooling function is enhanced, but the device complexity and weight increase
Solution Approach 1:
The patent merges multiple cooling components into an integrated liquid-cooling module where the heat receiving portion, radiator, pump, and reserve tank are combined into a single unified structure. This integration reduces the number of separate components and simplifies the overall device complexity while maintaining all necessary cooling functions. The merged design allows the module to be treated as one assembly unit, reducing mounting complexity and improving spatial efficiency on the board.
Solution Approach 2:
The liquid-cooling module is designed with multi-functionality, where a single integrated structure performs multiple cooling-related functions: the heat receiving portion contacts the LSI to absorb heat, the internal channels transport the coolant, the radiator dissipates heat to the environment, and the pump circulates the coolant. This universal design eliminates the need for separate dedicated components for each function, reducing overall device complexity while maintaining comprehensive cooling capability.
3Reliability
If the liquid-cooling module covers the board area around the LSI to provide sufficient cooling, then the cooling capacity is improved, but the space around the components becomes so small that the air flow tends to be impeded, restricting the mounting of heat generators
Solution Approach 1:
The patent applies segmentation by dividing the board area into distinct functional zones: the central region occupied by the liquid-cooling module for high-heat LSI components, and the peripheral regions around it for other heat-generating components. This spatial segmentation allows adequate air flow paths to be maintained around the peripheral components while the central liquid-cooling module provides concentrated cooling where most needed. The segmented layout enables flexible mounting of additional heat generators in the surrounding areas without compromising cooling capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable contact pressure between the heat receiving portion and the LSI, allows for the mounting of other components, and enhances airflow to prevent temperature increases in peripheral devices, improving overall cooling efficiency and packaging density.
Implementation Method 1
The heat receiving portion (8) is arranged on the LSI (1) to conduct heat therefrom to the liquid coolant
Implementation Method 2
a liquid coolant circulating system including a pump and pipes, as well as the liquid coolant which has received heat from the LSI
Implementation Method 3
a radiator are disposed above an LSI to circulate liquid
Implementation Method 4
a radiator are disposed above an LSI to circulate liquid
Data Source
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AI summary
When the side of a surface of the board on which the device to be cooled is mounted is defined as the upper side while the side of the other surface is defined as the lower side in a substantially vertical direction to the board, a cooling device includes a heat receiving portion arranged on the upper side the device to be cooled for performing heat exchange with the device to be cooled; a columnar portion standing substantially perpendicularly on the board; a base having a through hole which the columnar portion passes through, and arranged on the upper side of the heat receiving portion; and biasing means for biasing the base along the columnar portion to thereby press the heat receiving portion against the device to be cooled.