Bidirectional Heat Pipe Cooling Mechanism for High Mounting Flexibility
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Solution Overview
Problem
Conventional cooling modules restrict heat pipe arrangement, limiting cooling performance due to unidirectional extension and thermal resistance issues, which hinders efficient heat dissipation from high-speed electronic components.
Innovation Solution
A cooling mechanism with a heat sink, heat transfer blocks, and elastic members allows for flexible mounting of heat pipes in reverse directions, enabling symmetrical arrangement and enhanced heat dissipation by using position-limit sliding grooves and elastic thermal pads to maintain contact with heat sources, reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat pipes are arranged in unidirectional extension in conventional cooling modules, then the structure is simple, but the cooling performance is limited and heat dissipation efficiency is reduced
Solution Approach 1:
The patent transitions from unidirectional heat pipe arrangement to bidirectional symmetrical arrangement, utilizing both left and right sides of the heat sink base. This dimensional expansion allows heat pipes to extend in opposite directions from the heat transfer blocks, effectively doubling the heat dissipation pathways and improving overall cooling performance without significantly complicating the structure.
Solution Approach 2:
The patent employs asymmetrical positioning of heat pipes relative to the heat transfer blocks, with heat pipes arranged symmetrically on opposite sides of the heat sink base. This asymmetrical-bidirectional configuration optimizes heat distribution across the heat sink, allowing efficient heat dissipation from multiple heat sources while maintaining structural balance.
2Reliability
If different sizes of heat sinks are used to mate with different heat sources, then thermal resistance is reduced, but device complexity and mounting flexibility are worsened
Solution Approach 1:
The patent designs a universal heat sink base that can accommodate multiple heat sources of different sizes and configurations. The heat sink base integrates multiple accommodation portions and heat transfer blocks that can adapt to various CPU, GPU, or other heat-generating components, eliminating the need for multiple specialized heat sink designs while maintaining low thermal resistance through optimized heat pipe arrangements.
Solution Approach 2:
The heat sink base is segmented into multiple independent accommodation portions, each capable of hosting heat-generating components. This segmentation allows each section to be optimized for specific heat sources while the overall structure remains unified, reducing the need for multiple complete heat sink assemblies and simplifying device complexity.
3Manufacturing precision
If heat pipes are bonded to heat transfer blocks in fixed positions, then manufacturing precision is improved, but mounting flexibility and adaptability are reduced
Solution Approach 1:
The patent introduces elastic members that provide flexible, non-rigid connection between the heat transfer blocks and the heat sink base. This dynamic mounting mechanism allows the heat transfer blocks to be positioned at different locations while maintaining reliable thermal contact, combining the benefits of precise heat transfer with mounting flexibility and adaptability to various heat source configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency by allowing heat pipes to spread heat energy over a larger area and maintains effective contact with heat sources, reducing thermal resistance and enhancing overall cooling performance.
Implementation Method 1
a plurality of heat pipes (2) mounted in the heat sink (1) and oppositely arranged in parallel between the at least one heat transfer block (3) and the at least one elastic member (4)
Implementation Method 2
at least one elastic member (4) mounted in the heat sink (1)
Implementation Method 3
a heat sink (1), at least one heat transfer block (3) and at least one elastic member (4) mounted in the heat sink (1)
Data Source
AI summary
A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.