Bidirectional Heat Pipe Design for Enhanced Thermal Dissipation
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Solution Overview
Problem
Existing heat dissipation devices with heat pipes have limited efficiency due to unidirectional heat transfer to fins, restricting the optimal utilization of heat pipes and thus limiting the overall heat dissipation capability.
Innovation Solution
A heat dissipation device design featuring a first and second heat sink with heat pipes surrounding the periphery, including an evaporating portion adjacent to the electronic device and inwardly bending condensing portions extending through both heat sinks, allowing bidirectional heat transfer for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heat pipes transfer heat to fins in one direction only, then the structure is simple, but heat dissipation efficiency is limited
Solution Approach 1:
The heat pipe is segmented into multiple functional portions: an evaporating portion adjacent to the electronic device, a first condensing portion extending through the first heat sink, and a second condensing portion extending through the second heat sink. This segmentation allows heat to be dissipated in multiple directions simultaneously, resolving the contradiction between simple structure and high heat dissipation efficiency.
Solution Approach 2:
The heat pipe structure transitions from a single-direction linear arrangement to a multi-dimensional configuration where the evaporating portion is surrounded by condensing portions extending through both heat sinks. This dimensional change enables heat to transfer in multiple directions (through first and second heat sinks), significantly improving heat dissipation efficiency while maintaining structural feasibility.
2Productivity
If heat pipes are configured to surround the entire periphery of the first heat sink, then heat dissipation efficiency is enhanced, but manufacturing complexity increases
Solution Approach 1:
The heat pipe is divided into distinct segments (evaporating portion, first condensing portion, second condensing portion) that can be manufactured and assembled separately. The evaporating portion is positioned adjacent to the electronic device, while condensing portions extend through the heat sinks, allowing modular manufacturing that balances enhanced heat dissipation with manufacturing feasibility.
Solution Approach 2:
The heat pipe structure is nested within the heat sink assembly, with the evaporating portion positioned adjacent to the electronic device and condensing portions extending through the heat sinks. This nested configuration allows the complex heat pipe structure to be integrated into the existing heat sink design, reducing overall manufacturing complexity while achieving enhanced heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high heat dissipation efficiency by facilitating bidirectional heat transfer through the heat pipes, effectively utilizing the entire periphery of the heat sinks to dissipate heat from electronic devices.
Implementation Method 1
at least one heat pipe connecting with both the first heat sink and the second heat sink. The at least one heat pipe surrounds an entire periphery of the first heat sink and comprises an evaporating portion, a first condensing portion and a second condensing portion
Implementation Method 2
The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other
Implementation Method 3
The first condensing portion and the second condensing portion extend from two opposite ends of the evaporating portion respectively
Implementation Method 4
a first heat sink thermally contacting with an electronic device, a second heat sink mounted on the first heat sink
Implementation Method 5
a plurality of fins extending from the base and heat pipes. Each of the heat pipes comprises an evaporator engaging with the base and two condensers engaging with the fins
Data Source
AI summary
A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.