Bi-directional Heatsink Tunnel Mitigates Thermal Shadowing
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Solution Overview
Problem
In information handling systems, the geometric layout of components within server chassis often results in challenging cooling conditions known as 'thermal shadowing,' where pre-heated air from heat-dissipating components reduces cooling effectiveness for adjacent components oriented in series.
Innovation Solution
A bi-directional heatsink with a conductive base and multiple cooling fins, featuring a tunnel structure that directs a second air flow perpendicular to the first air flow, mitigates thermal shadowing by providing supplemental cooling to downstream components without significant heat absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heat dissipating components are oriented in series with respect to airflow path, then the layout accommodates IC manufacturer geometric specifications and standard IT rack layout, but thermal shadowing occurs where pre-heated air reduces cooling effectiveness for downstream components
Solution Approach 1:
The airflow path is segmented into two separate channels: a first airflow path for cooling the upstream component through conventional finned heatsinks, and a second airflow path that bypasses the heatsinks to provide cold air to downstream components. This segmentation allows both series-oriented components to receive effectively cooled air without thermal shadowing.
Solution Approach 2:
A ducting structure acts as an intermediary element that introduces a second airflow path through the chassis enclosure. This ducting structure carries cold air from the cold air inlet directly to downstream components, bypassing the heated airflow region and mitigating thermal shadowing effects.
2Loss of energy
If a conventional heatsink with finset is used to dissipate thermal energy from ICs, then convective cooling is achieved, but adjacent components receive preheated air due to thermal energy radiation and airflow heating
Solution Approach 1:
The harmful preheated airflow is extracted from the path to downstream components by creating a separate bypass channel. The ducting structure removes cold air directly from the cold air inlet and delivers it to downstream components, taking out the heating effect from the equation and preventing thermal shadowing while maintaining effective thermal energy dissipation at upstream components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces pre-heating of downstream components by directing a high-velocity second air flow through tunnels in the heatsink, enhancing cooling efficiency and minimizing thermal shadowing, thereby maintaining optimal operating temperatures for compute components.
Implementation Method 1
a base having a conductive surface for receiving thermal energy
Implementation Method 2
a finset of more than one cooling fin each having a plate structure and attached to the base in spaced arrangement. The finset receives a first air flow that is parallel to each of the cooling fins
Implementation Method 3
A tunnel is formed in parallel to the conductive surface on a bottom of the base and through the more than one cooling fin. The tunnel is also formed perpendicularly to the first air flow. The tunnel directs a second air flow to a downstream compute component
Data Source
AI summary
An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink.