Bi-directional MOSFET Cooling Paths for Electric Machine Thermal Management
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Solution Overview
Problem
Conventional electric machines, such as vehicle alternators, face challenges in efficiently dissipating heat generated by their electrical circuitry, particularly due to increased demands on alternator components, which can lead to elevated component temperatures and reduced cooling efficiency.
Innovation Solution
The implementation of a power module with a thermally conductive base and a MOSFET driver in conductive thermal communication, utilizing separate primary and secondary cooling paths to direct heat from the MOSFET and MOSFET driver to a heat sink and ambient air, respectively, along with a cooling tower design that maximizes spatial dispersion of power electronics and centrally locates control electronics for optimal cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods are used for alternator circuitry, then the structure is simple, but heat dissipation efficiency is insufficient leading to elevated component temperatures
Solution Approach 1:
The cooling system is segmented into two separate cooling paths: a primary cooling path that directs heat from the MOSFET to the heat sink, and a secondary cooling path that directs heat from the MOSFET driver to ambient air. This segmentation allows each path to be optimized for its specific cooling requirements, improving overall heat dissipation efficiency while maintaining manageable system complexity through modular design
Solution Approach 2:
The invention transitions from conventional single-path cooling to a multi-dimensional cooling architecture with separate primary and secondary cooling paths operating in parallel. This dimensional change in the cooling system structure enables simultaneous heat dissipation from multiple heat-generating components through different thermal pathways, significantly improving heat dissipation efficiency
2Power
If increased demands are placed on alternator components, then power output increases, but heat generation increases leading to reduced cooling efficiency
Solution Approach 1:
The invention converts the harmful effect of increased heat generation (resulting from higher power demands) into a beneficial cooling effect by designing a dual-path cooling system. The primary cooling path efficiently directs heat from the MOSFET to the heat sink, while the secondary cooling path directs heat from the MOSFET driver to ambient air, thereby converting the problem of excessive heat into an optimized thermal management solution that supports higher power output
Solution Approach 2:
The invention changes the thermal management parameters by implementing separate cooling paths with different thermal resistance characteristics. The primary cooling path is optimized for high-power MOSFET heat dissipation through the heat sink, while the secondary cooling path is optimized for MOSFET driver heat dissipation to ambient air, allowing the system to handle increased power demands with improved thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal conduction resistance and minimizes device temperatures by utilizing bi-directional cooling paths and optimizing the layout of power and control electronics, enhancing cooling performance and reducing power loss in electric machines.
Implementation Method 1
a thermally conductive base having opposite first and second surfaces. The first surface is adapted for mounting the power module in conductive thermal communication with a heat sink
Implementation Method 2
The transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air
Data Source
AI summary
A power module for an electric machine. The power module includes a thermally conductive base having opposite first and second surfaces. The first surface is adapted for mounting the power module in conductive thermal communication with a heat sink. A MOSFET superposes the base second surface and is in conductive thermal communication with the base. A MOSFET driver superposes the base second surface and is operatively connected to the MOSFET. The transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air. The primary and secondary cooling paths are separate from each other. An electronics package and an electric machine including a power module are also disclosed.