Bidirectional Radiator Cooling for Thin Electronic Devices
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Solution Overview
Problem
Thinner and more compact electronic devices, such as tablet and laptop personal computers, face challenges in efficiently cooling high-performance CPUs due to limited internal space, leading to potential CPU damage from increased heat generation.
Innovation Solution
The implementation of an electronic equipment system with a housing containing a heat source, a radiator facing an exhaust port, a heat transfer unit connected to both the heat source and radiator, and a blower fan for heat discharge, along with an intake-side radiator and heat transfer unit to efficiently radiate heat into both discharged and intake air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the device is made thinner and more compact, then the portability and form factor are improved, but the cooling efficiency deteriorates due to limited internal space
Solution Approach 1:
The patent introduces a third dimension for heat dissipation by placing a radiator at the intake port (opposite to the exhaust port), creating a bidirectional heat radiation approach. This dimensional expansion allows heat to be dissipated in multiple directions simultaneously, overcoming the space limitations of thin devices while maintaining effective cooling.
Solution Approach 2:
The cooling system is segmented into multiple independent heat transfer paths: one through the exhaust port with its radiator, and another through the intake port with its radiator. This segmentation allows each radiator to operate independently and efficiently, maximizing heat dissipation within the constrained space of a thin device.
2Device complexity
If a single radiator is used, then the device complexity is reduced, but the cooling capacity is insufficient for high-performance CPUs
Solution Approach 1:
The cooling system is divided into two independent radiators positioned at opposite ports (exhaust and intake), each handling heat dissipation in its respective direction. This segmentation enables sufficient cooling capacity for high-performance CPUs while keeping each individual radiator component simple and manageable.
Solution Approach 2:
The patent combines two radiators operating in parallel at different locations (exhaust port and intake port) to create a unified cooling system with enhanced capacity. This merging of multiple heat dissipation paths achieves the required cooling performance without requiring an overly complex single-system design.
3Device complexity
If heat is only radiated into discharged air, then the cooling system is simpler, but the heat dissipation efficiency is reduced
Solution Approach 1:
The heat radiation is extended from a unidirectional approach (only into discharged air) to a bidirectional approach by adding heat radiation into intake air as well. This dimensional expansion in the heat dissipation pathway significantly improves heat dissipation efficiency by utilizing both air flows.
Solution Approach 2:
The patent converts the intake air, which would normally just be ambient air entering the device, into a beneficial cooling medium by radiating heat into it. This transforms a passive air flow into an active heat dissipation pathway, improving overall cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat dissipation by radiating heat into both discharged air from the exhaust port and intake air, ensuring the CPU is cooled efficiently, even when the device is used independently or attached to an extended device.
Implementation Method 1
a heat transfer unit connected to the heat source; a first radiator located adjacent to said exhaust port, wherein said first radiator is connected to said heat transfer unit
Implementation Method 2
a first radiator located adjacent to said exhaust port... a second radiator located adjacent to said intake port
Implementation Method 3
a blower fan for discharging heat transmitted to the first radiator; heat dissipation by radiating heat into both discharged air from the exhaust port and intake air
Implementation Method 4
a blower fan for discharging heat transmitted to the first radiator together with air
Data Source
AI summary
An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.