Bidirectional Switch Module Without Insulating Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power semiconductor modules used in bidirectional switches are costly and have poor heat dissipation due to the use of insulating substrates, which increases manufacturing costs and reduces heat conductivity.
Innovation Solution
A bidirectional switch module is designed without an insulating substrate, where semiconductor elements are directly mounted on metal base plates, with junction electrodes of the same potential connected to the metal base plates, eliminating the need for a wiring layer and enhancing heat dissipation by using metal base plates as heat dissipation plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating substrate is used to mount semiconductor elements, then the module structure is complete and functional, but the cost increases and heat dissipation deteriorates
Solution Approach 1:
The patent removes the insulating substrate from the module structure entirely. Semiconductor elements are mounted directly on the metal base plate, eliminating the need for separate insulating substrate components and reducing manufacturing complexity while improving heat dissipation pathways.
Solution Approach 2:
The patent combines the mounting function and heat dissipation function into a single metal base plate. The metal base plate serves both as the structural support for mounting semiconductor elements and as the primary heat dissipation path, eliminating the need for separate insulating substrate layers.
2Ease of manufacture
If a resin insulating layer is used to reduce cost, then manufacturing cost decreases, but heat conductivity deteriorates
Solution Approach 1:
The patent extracts and removes the resin insulating layer from the module structure. By eliminating this low heat conductivity material, the patent establishes direct thermal contact between semiconductor elements and the metal base plate, creating an efficient heat dissipation path without relying on thermal conduction through resin materials.
3Ease of manufacture
If conventional module technology with insulating substrate and wiring layer is used, then semiconductor elements can be mounted, but the structure becomes complex and costly
Solution Approach 1:
The patent removes the wiring layer and insulating substrate from the conventional module structure. Electrical connections are achieved through direct bonding of semiconductor element terminals to the metal base plate, eliminating the need for separate wiring layers and reducing structural complexity.
Solution Approach 2:
The patent merges the electrical connection function and mechanical mounting function into a single direct bonding process. Semiconductor elements are mounted directly on the metal base plate with electrical connections established through the bonding process itself, eliminating the need for separate wiring and insulating substrate layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, improves heat conductivity, and enhances the reliability of semiconductor elements by eliminating the insulating substrate and wiring layer, while maintaining effective bidirectional current flow.
Implementation Method 1
a metal base plate to be heat dissipation plate
Implementation Method 2
the metal base plate and non-junction electrodes of the semiconductor elements are respectively connected by metal thin wires
Data Source
AI summary
A first semiconductor element having a junction electrode to be connected to a first node of a bidirectional switch circuit is mounted on a first metal base plate to be a heat dissipation plate, and a second semiconductor element having a junction electrode to be connected to a second node of the bidirectional switch circuit is mounted on a second metal base plate to be a heat dissipation plate. The junction electrode of the first semiconductor element has the same potential as that of the first metal base plate, and the junction electrode of the second semiconductor element has the same potential as that of the second metal base plate. Also, the respective metal base plates and non-junction electrodes of the respective semiconductor elements are connected by metal thin wires, respectively, thereby configuring the bidirectional switch circuit.