Bi-directional Token Ring for Semiconductor Power Budget Management
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Solution Overview
Problem
Conventional semiconductor devices with a single directional ring structure experience performance degradation due to excessive current consumption during peak zone operations, leading to operation failures and inefficient high-priority task execution.
Innovation Solution
A semiconductor device with a bi-directional ring structure that allows chips to share tokens dynamically, enabling peak zone operations based on available and required token amounts, optimizing peak current consumption and prioritizing high-priority tasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a single directional ring structure is used to manage power budget with tokens, then power consumption is controlled, but operational performance is degraded due to chips waiting for sufficient tokens
Solution Approach 1:
The patent changes the static single-directional token ring into a dynamic bi-directional token ring structure. Chips can now receive tokens from both adjacent chips (previous and next chips in the ring), allowing dynamic adaptation of token flow direction based on operational needs. This enables chips to obtain tokens more quickly without increasing overall power consumption, thus improving operational performance while maintaining energy control.
Solution Approach 2:
The patent adds a new dimension to the token distribution system by introducing bi-directional communication. Instead of tokens flowing in one dimension (single direction), the system now allows token flow in two dimensions (both directions around the ring). This enables chips to access tokens from either direction, reducing waiting time and improving productivity without compromising power budget management.
2Loss of energy
If chips wait to collect sufficient tokens before performing peak zone operations, then power budget is managed, but high-priority operations are delayed
Solution Approach 1:
The bi-directional token ring structure enables preliminary token accumulation from multiple sources. Chips can pre-collect tokens from both adjacent chips simultaneously, reducing the time needed to accumulate sufficient tokens for peak zone operations. This preliminary action from multiple directions allows high-priority operations to start sooner while still respecting power budget constraints.
Solution Approach 2:
The patent ensures continuous token flow to chips from both directions in the ring structure. Instead of intermittent token availability from a single direction, chips experience continuous token supply from multiple sources, eliminating idle waiting periods. This continuity allows high-priority operations to be performed promptly while maintaining overall power budget management through the token mechanism.
3Productivity
If multiple chips attempt simultaneous peak zone operations, then operational throughput is increased, but current consumption exceeds power budget limits
Solution Approach 1:
The token ring structure provides feedback control for power budget management. Each chip receives tokens from adjacent chips and uses these tokens to authorize peak zone operations. The bi-directional nature enhances this feedback mechanism by allowing tokens to circulate and be distributed more efficiently from multiple sources, enabling better coordination of simultaneous operations to stay within power budget limits while maximizing throughput.
Solution Approach 2:
The patent changes the parameter of token flow direction from unidirectional to bidirectional. This parameter change allows for more flexible distribution of tokens across the chip network, enabling dynamic adjustment of operation timing and sequencing. As a result, multiple chips can perform peak zone operations simultaneously or near-simultaneously by obtaining tokens from different directions, increasing throughput while maintaining power budget compliance.
Data Source
AI summary
A semiconductor device includes a plurality of chips including first and second chips, each of the first and second chips including a first input terminal receiving a first token input signal, a first output terminal outputting a first token output signal, a second input terminal receiving a second token input signal, and a second output terminal outputting a second token output signal. The first and second chips are coupled to each other in a bi-directional ring structure such that the first output terminal of the first chip is coupled to the first input terminal of the second chip and the second output terminal of the second chip is coupled to the second input terminal of the first chip. Each of the first and second chips performs a corresponding peak zone operation according to the first token input signal and the second token input signal.