Bifurcated Air Flow Electronics Cooling via Liquid Heat Exchange
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Solution Overview
Problem
Current air-cooling systems for electronics face challenges in managing increased heat dissipation in large server applications, leading to overheating, noise issues, and electromagnetic interference due to the limitations of conventional air flow paths and cooling methods.
Innovation Solution
The implementation of a cooled electronics system that utilizes a cabinet with bifurcated air flow and multiple air-to-liquid heat exchangers within the frame or cabinet, allowing air to circulate in dual closed loop paths and sharing side air returns between adjacent frames to enhance cooling efficiency and reduce noise and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If increased air flow rates are used to cool high power modules, then cooling effectiveness is improved, but acoustic noise level and power consumption of air moving devices increase
Solution Approach 1:
The patent introduces liquid cooling channels as an intermediary cooling medium between the electronics components and the air flow. The liquid absorbs heat from the components through heat sinks or heat exchangers, then transports it to remote air-to-liquid heat exchangers where it is dissipated. This mediator approach allows effective heat removal without requiring high-velocity air flow directly over the components, thereby reducing acoustic noise while maintaining cooling effectiveness.
2Ease of operation
If conventional openings are provided in the frame for air entry and exit, then air flow is facilitated, but acoustic treatment and electromagnetic shielding become difficult
Solution Approach 1:
The patent extracts the heat dissipation function from the main electronics frame by implementing separate air-to-liquid heat exchangers positioned remotely from the electronics components. The liquid cooling system extracts heat at the source through heat sinks, then transports it away via liquid channels to dedicated heat exchanger locations. This separation allows the electronics frame to have minimized or sealed openings, improving acoustic and electromagnetic shielding while the remote heat exchangers handle air flow for heat dissipation.
3Temperature
If multiple air moving devices are deployed in the frame, then cooling capacity is improved, but total acoustic noise at the frame level becomes unacceptable
Solution Approach 1:
The liquid cooling system serves as an intermediary that decouples the cooling capacity requirement from the number and power of air moving devices. Instead of using multiple powerful fans that generate high noise levels, the system uses a liquid circulation pump (which operates much more quietly) to transport heat,配合 remote air-to-liquid heat exchangers that can be positioned away from the electronics compartment. This allows high cooling capacity with minimal acoustic noise from air moving devices.
4Temperature
If greater air flow is provided through a single drawer using a more powerful air moving device, then cooling of that drawer is improved, but the approach becomes unmanageable at the frame level
Solution Approach 1:
The liquid cooling system provides a universal cooling infrastructure that serves multiple drawers and components simultaneously through a single integrated liquid circulation loop. Instead of requiring separate powerful air moving devices for each drawer, the liquid cooling system can distribute cooling capacity across multiple locations via the liquid circulation pump and network of cooling channels. This multi-functional approach simplifies frame-level management while maintaining effective cooling across all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases heat removal capacity, reduces air flow impedance, and improves acoustic treatment while maintaining compactness and safety standards, enabling the handling of higher heat loads and reducing the burden on room air conditioning.
Implementation Method 1
The at least one air-to-liquid heat exchanger is disposed within the cabinet or the frame to facilitate cooling of the air flow across the at least one electronics drawer
Implementation Method 2
The air moving device moves air within the cabinet to establish an air flow across the at least one electronics drawer
Data Source
AI summary
Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.