Bilayer Deposition Die With Interposers for Thickness Profiling
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Solution Overview
Problem
Existing battery manufacturing processes face challenges in precisely and efficiently generating specific thickness profiles for materials deposited on substrates, particularly in secondary batteries, where uniformity is crucial except in controlled reduction areas.
Innovation Solution
A die system with interposers in its cavities shapes and directs materials to form distinct thickness profiles by controlling the flow of materials through strategically designed openings and cavities, allowing for precise adjustment of material deposition on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional deposition methods are used to deposit material on substrate, then material can be deposited, but the thickness profile cannot be precisely controlled and remains uniform without ability to create controlled reduction areas
Solution Approach 1:
The die is divided into multiple cavities (first cavity, second cavity) with separate openings, allowing independent control of material deposition in different regions. Each cavity can be equipped with interposers to create specific thickness profiles, enabling precise control over the overall thickness distribution on the substrate.
Solution Approach 2:
Interposers are placed specifically within certain cavities (e.g., first cavity with first interposer, second cavity with second interposer) to create localized thickness variations. This allows different regions of the deposited material to have different thickness characteristics, achieving the desired thickness profile with controlled reduction areas while maintaining uniformity where needed.
2Manufacturing precision
If multiple separate deposition processes are used to achieve different thickness profiles, then thickness control can be improved, but manufacturing complexity and time increase
Solution Approach 1:
Multiple deposition functions are merged into a single die system with multiple cavities and openings. The die can deposit materials with different thickness profiles simultaneously in one operation, eliminating the need for multiple separate deposition processes and thereby maintaining high productivity while achieving precise thickness control.
Solution Approach 2:
The die is designed as a multi-functional tool that can create various thickness profiles by configuring interposers in different cavities. This universal die structure can handle different deposition requirements without requiring process changes, improving both precision and efficiency.
3Stability of the object's composition
If material deposition is increased to ensure balanced electrode compositions, then composition balance is achieved, but material usage efficiency decreases due to inability to control thickness variations
Solution Approach 1:
Interposers are placed in advance within the cavities to pre-determine the thickness profile of deposited material. This preliminary configuration ensures that material is deposited with the correct thickness distribution from the start, preventing both excessive deposition (waste) and insufficient deposition (composition imbalance).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise and efficient deposition of materials with different thickness profiles, improving the manufacturing of secondary batteries by allowing for fine adjustments and optimized material usage, preventing undesirable crystallization and ensuring balanced electrode compositions.
Implementation Method 1
The die system is adapted to receive a first material in a first cavity and to discharge the first material along a first deposition direction through a first opening. The die system is adapted to extrude a second material in a second cavity and to discharge the second material along a second deposition direction through a second opening.
Data Source
Figure 1
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Figure 2B
AI summary
A die system comprises a first opening, a first cavity, a second opening, a second cavity, a first interposer and a second interposer. The first opening and the first cavity are fluidly connected to each other. The second opening and the second cavity are fluidly connected to each other. The second opening is spaced from the first opening. The die system is adapted to receive a first material in the first cavity and to discharge the first material along a first deposition direction through the first opening. The die system is adapted to extrude a second material in the second cavity and to discharge the second material along a second deposition direction through the second opening. The first interposer is arranged in the first cavity and adapted such that the first material discharged from the first cavity and along the first interposer forms a first thickness profile. The second interposer arranged in the second cavity and adapted such that the second material discharged through the second cavity and along the second interposer forms a second thickness profile that is different from the first thickness profile.