Electrostatic Chuck Support With Bimetal Flatness Compensation
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in compensating for thermal deformation between materials with different thermal deformation rates, leading to bending issues in the chuck during etching processes.
Innovation Solution
A support unit incorporating a bimetal member is used to compensate for thermal deformation. The bimetal member includes a pin that moves up or down based on the difference in thermal deformation between two members, effectively counteracting the bending caused by thermal differences within the support plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is provided inside the chuck to treat the substrate at process temperature, then the substrate can be heated to the required temperature, but the chuck is bent due to the difference in the amount of thermal deformation between the dielectric plate and the insulating plate
Solution Approach 1:
The patent changes the physical parameters of the bimetal member (material composition, thickness ratio) to match the thermal deformation characteristics of the support plate. By selecting materials with specific thermal expansion coefficients and adjusting the thickness ratio, the bimetal member's deformation parameter is tuned to compensate for the support plate's thermal deformation, maintaining chuck flatness while heating the substrate to process temperature.
Solution Approach 2:
The patent uses a bimetal member composed of two different metals with distinct thermal expansion coefficients. This composite structure allows the member to deform in a controlled manner when heated, with one metal layer expanding more than the other, creating a bending effect that counteracts the support plate's thermal deformation and restores the chuck's flatness.
2Shape
If the shape of the chuck is designed or additionally processed in consideration of the difference in the amount of thermal deformation, then the chuck flatness can be compensated, but time and costs are consumed for designing and processing the chuck
Solution Approach 1:
The bimetal member automatically compensates for thermal deformation through its inherent material properties and structural design. When the chuck is heated, the bimetal member naturally deforms to counteract the support plate's bending without requiring external control systems, complex algorithms, or manual adjustments. This self-compensating mechanism reduces design complexity and eliminates the need for additional processing steps.
Solution Approach 2:
By changing the material parameters and geometric parameters of the bimetal member during the design phase, the patent creates a passive compensation system. The thickness ratio, material selection, and dimensional parameters are optimized so that the bimetal member's thermal deformation automatically matches the required compensation amount, simplifying both design and manufacturing processes while reducing time and costs.
3Shape
If the shape of the chuck is designed or additionally processed in consideration of the difference in the amount of thermal deformation, then the chuck flatness can be compensated, but costs are consumed for designing and processing the chuck
Solution Approach 1:
The bimetal member provides automatic thermal deformation compensation through its inherent material properties, eliminating the need for complex active control systems, sensors, or additional processing operations. This passive compensation mechanism reduces manufacturing complexity, lowers production costs, and simplifies the overall chuck structure while maintaining flatness during thermal processing.
Solution Approach 2:
The use of a bimetal member with two different metals provides a cost-effective solution for thermal deformation compensation. By selecting materials with appropriate thermal expansion coefficients and optimizing the thickness ratio, the patent achieves automatic compensation without requiring expensive active control systems, complex machining operations, or additional components, thereby reducing manufacturing costs while maintaining chuck flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bimetal member effectively compensates for thermal deformation, ensuring the substrate remains flat on the support unit, thereby reducing the need for complex design and processing of the chuck, and minimizing time and costs associated with these processes.
Implementation Method 1
configured to compensate for bending of the support plate due to heat, in which the bimetal member includes: a pin provided to be in contactable with a bottom surface of the substrate that is placed on the support plate; a first member configured to support the pin; and a second member provided to surround the first member, and the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the first member and the second member
Implementation Method 2
a heater provided inside the support plate and configured to heat the substrate
Implementation Method 3
a support plate on which a substrate is placed, and which includes an electrostatic electrode providing electrostatic force to the substrate
Data Source
AI summary
The present invention provides a support unit, including: a support plate on which a substrate is placed, and which includes an electrostatic electrode providing electrostatic force to the substrate; a heater provided inside the support plate and configured to heat the substrate; an insulating plate provided under the support plate as an insulating substance; and a bimetal member disposed inside the support plate and configured to compensate for bending of the support plate due to heat, in which the bimetal member includes: a pin provided to be in contactable with a bottom surface of the substrate that is placed on the support plate; a first member configured to support the pin; and a second member provided to surround the first member, and the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the first member and the second member.