Bi-Metal Mini-Channel Cold Plate for Adaptive Hot-Spot Cooling
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Solution Overview
Problem
Conventional cooling systems for wide-bandgap semiconductor devices face challenges in achieving uniform thermal distribution and efficient heat management due to smaller sizes leading to worse thermal performance, resulting in unbalanced thermal states and reduced system reliability.
Innovation Solution
The implementation of mini-channel cold plate cooling assemblies with three-dimensional adaptive flow-paths utilizing bi-metal fins that deform in response to temperature changes, adjusting coolant flow paths to optimize heat dissipation without requiring external energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional multi-pass cold plates are used for cooling wide-bandgap semiconductor devices, then cooling function is provided, but unbalanced thermal status occurs due to increased temperature and multi-level topology
Solution Approach 1:
The bi-metal fins are designed to dynamically change the coolant flow path in response to temperature variations. When temperature increases, the bi-metal fins deform to redirect coolant flow to hotter areas, creating a dynamic adaptation mechanism that maintains thermal uniformity and prevents localized overheating, thereby improving both thermal uniformity and system reliability
Solution Approach 2:
The invention changes the physical state and geometry of the coolant flow path through temperature-dependent deformation of bi-metal fins. As temperature parameters change, the fins alter the flow path configuration, enabling the system to adapt to varying thermal conditions and maintain balanced thermal status across different operating points
2Ease of manufacture
If smaller wide-bandgap semiconductor device sizes are used to reduce cost, then cost reduction is achieved, but thermal performance deteriorates
Solution Approach 1:
The cooling system performs self-adjustment through the bi-metal fins that automatically deform in response to temperature changes without external control. This self-service mechanism ensures that even small semiconductor devices with limited heat dissipation capacity can maintain optimal thermal conditions, compensating for the reduced thermal performance inherent in smaller device sizes
Solution Approach 2:
The bi-metal fin structure creates locally adapted cooling channels that concentrate coolant flow precisely where heat generation occurs. This local quality enhancement ensures that each small semiconductor device receives adequate cooling tailored to its specific thermal output, maintaining overall thermal performance despite reduced device size
3Temperature
If bi-metal fins are used to dynamically adjust coolant flow path, then thermal uniformity is enhanced, but device complexity increases
Solution Approach 1:
The bi-metal fins provide self-regulating flow path adjustment without requiring external sensors, controllers, or power sources. The temperature-dependent deformation of the bi-metal material itself serves as the control mechanism, simplifying the overall system architecture while achieving enhanced thermal uniformity through passive adaptation
Solution Approach 2:
The invention utilizes the thermal expansion and differential expansion properties of bi-metal materials to achieve flow path adjustment. This physical phenomenon-based approach replaces complex active control systems with a simple, reliable thermal-mechanical response that enhances thermal uniformity while minimizing added complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal uniformity and efficiency by dynamically adjusting coolant flow, concentrating coolant to hot areas and preventing over-cooling, thereby improving the reliability and performance of wide-bandgap semiconductor devices.
Implementation Method 1
heat from a semiconductor device of the plurality of semiconductor devices causes a coolant introduced between the cold plate top wall and the cold plate bottom wall to raise temperature of the coolant, which causes a bi-metal fin positioned proximal to the heated semiconductor device to deform and change a flow path of the coolant
Data Source
AI summary
The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.